Alliance Memory NAND 10 GB Flash Memory FBGA, ASFC10G31P3-51BIN
- N° de stock RS:
- 338-523
- Référence fabricant:
- ASFC10G31P3-51BIN
- Fabricant:
- Alliance Memory
Sous-total (1 plateau de 1520 unités)*
154 938,16 €
(TVA exclue)
187 475,28 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Temporairement en rupture de stock
- Expédition à partir du 12 juin 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Unité | Prix par unité | le plateau* |
|---|---|---|
| 1520 + | 101,933 € | 154 938,16 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 338-523
- Référence fabricant:
- ASFC10G31P3-51BIN
- Fabricant:
- Alliance Memory
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Alliance Memory | |
| Product Type | Flash Memory | |
| Memory Size | 10GB | |
| Package Type | FBGA | |
| Maximum Clock Frequency | 200MHz | |
| Cell Type | NAND | |
| Minimum Supply Voltage | 2.7V | |
| Maximum Supply Voltage | 3.6V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 85°C | |
| Height | 1mm | |
| Length | 13mm | |
| Standards/Approvals | RoHS Compliant | |
| Automotive Standard | No | |
| Supply Current | 132mA | |
| Series | ASFC 3D pSLC | |
| Sélectionner tout | ||
|---|---|---|
Marque Alliance Memory | ||
Product Type Flash Memory | ||
Memory Size 10GB | ||
Package Type FBGA | ||
Maximum Clock Frequency 200MHz | ||
Cell Type NAND | ||
Minimum Supply Voltage 2.7V | ||
Maximum Supply Voltage 3.6V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 85°C | ||
Height 1mm | ||
Length 13mm | ||
Standards/Approvals RoHS Compliant | ||
Automotive Standard No | ||
Supply Current 132mA | ||
Series ASFC 3D pSLC | ||
- Pays d'origine :
- DE
The Alliance Memory e-MMC is a managed non-volatile storage consisting of a single chip MMC controller and a NAND flash memory chip inside a JEDEC defined standard BGA package. It is specially designed as a small form factor memory product for storage of data and as a boot media. The performance is optimized to a mostly read operation mode at low power consumption. The utilization of 3D pSLC NAND technology targets higher demanding and write intensive industrial applications, which is supported by the industrial temperature grade specification. The e-MMC controller directly manages NAND flash, including ECC, wear-leveling, IOPS optimization and read sensing. The 3D PSLC firmware features support high throughput for large data transfers and performance for small random data more commonly found in code usage. It also contains several security features as well as multiple boot partitions. Uses advanced refresh features for retention optimization for read intensive applications.
Capacities 10G
Fully compliant with JEDEC eMMC 5.1 Standard JESD84-B51
153-ball BGA 0.5mm pitch 11.5 x 13mm RoHS compliant
3D TLC NAND base technology in Enhanced Mode pSLC
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