TE Connectivity 2.54mm Pitch Vertical 32 Way, Through Hole Stamped Pin Closed Frame IC Dip Socket

Voir l’ensemble des DIL Sockets
Indisponible
RS n'aura plus ce produit en stock.
Options de conditionnement :
N° de stock RS:
719-8817
Référence fabricant:
2-382189-1
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Number of Contacts

32

Mounting Type

Through Hole

Pin Type

Stamped

Pitch

2.54mm

Row Width

15.24mm

Frame Type

Closed Frame

Termination Method

Solder

Contact Plating

Tin

Orientation

Vertical

Length

40.51mm

Width

5.33mm

Depth

17.63mm

Dimensions

40.51 x 5.33 x 17.63mm

Maximum Operating Temperature

+105°C

Minimum Operating Temperature

-55°C

Contact Material

Beryllium Copper

Housing Material

Thermoplastic

Pays d'origine :
US

TE Connectivity DIPLOMATE Dual Leaf PCB Mount DIP Socket


DIPLOMATE Dual Leaf (DL) DIP sockets with stamped and formed dual wiping contacts for vertical, through hole PCB mounting. These DIPLOMATE Dual Leaf (DL) DIP sockets have black thermoplastic GF stackable housings with a 2.54mm centreline, and a "true closed bottom" design which prevents solder or flux wicking and standoffs to allow board clearance for cleaning after soldering. The profiles for these DIPLOMATE Dual Leaf (DL) DIP sockets are all standard apart from part number 719-8817 which has an over-the-component profile. These DIPLOMATE DIP sockets are available with different frame styles with either straight or retention legs.

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