TE Connectivity 2.54mm Pitch Vertical 8 Way, Through Hole Turned Pin Open Frame IC Dip Socket, 3A
- N° de stock RS:
- 161-4985
- Référence fabricant:
- 808-AG10D
- Fabricant:
- TE Connectivity
Indisponible
RS n'aura plus ce produit en stock.
- N° de stock RS:
- 161-4985
- Référence fabricant:
- 808-AG10D
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Number of Contacts | 8 | |
| Mounting Type | Through Hole | |
| Pin Type | Turned | |
| Pitch | 2.54mm | |
| Row Width | 7.62mm | |
| Frame Type | Open Frame | |
| Termination Method | Solder | |
| Contact Plating | Gold | |
| Current Rating | 3A | |
| Orientation | Vertical | |
| Length | 10.16mm | |
| Width | 10.16mm | |
| Depth | 2.67mm | |
| Dimensions | 10.16 x 10.16 x 2.67mm | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | +105°C | |
| Contact Material | Beryllium Copper | |
| Housing Material | PET | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Number of Contacts 8 | ||
Mounting Type Through Hole | ||
Pin Type Turned | ||
Pitch 2.54mm | ||
Row Width 7.62mm | ||
Frame Type Open Frame | ||
Termination Method Solder | ||
Contact Plating Gold | ||
Current Rating 3A | ||
Orientation Vertical | ||
Length 10.16mm | ||
Width 10.16mm | ||
Depth 2.67mm | ||
Dimensions 10.16 x 10.16 x 2.67mm | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature +105°C | ||
Contact Material Beryllium Copper | ||
Housing Material PET | ||
Standard, Gold Plated - TE Connectivity
These sockets have precision four-fingered inner contacts for high reliability.
Precision four-finger inner contact provides concentric funnel entry for easy flat and round lead insertion
"X" and "Y" Stackable
Low profile
Accommodates rectangular or round IC leads
Non-wicking, closed bottom sleeve gives 100% protection against flux and solder contamination
Recognized under the Component Program of Underwriters Laboratories, Inc. file No. E111362
Beryllium copper inner contact for maximum mechanical and electrical performance
"X" and "Y" Stackable
Low profile
Accommodates rectangular or round IC leads
Non-wicking, closed bottom sleeve gives 100% protection against flux and solder contamination
Recognized under the Component Program of Underwriters Laboratories, Inc. file No. E111362
Beryllium copper inner contact for maximum mechanical and electrical performance
Liens connexes
- TE Connectivity 2.54mm Pitch Vertical 40 Way 3A
- Preci-Dip 2.54mm Pitch Vertical 40 Way 1A
- Preci-Dip 2.54mm Pitch Vertical 6 Way 1A
- Winslow 2.54mm Pitch Vertical 22 Way 5A
- Winslow 2.54mm Pitch Vertical 24 Way 5A
- TE Connectivity Through Hole Stamped Pin Open Frame IC Dip Socket, 3A
- Winslow 2.54 mm Pitch Vertical 20 Way 3A
- Winslow 2.54 mm Pitch Vertical 14 Way 3A