Terasic SDI to HSMC Adapter Board P0039

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Sous-total (1 unité)*

578,02 €

(TVA exclue)

699,40 €

(TVA incluse)

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  • Expédition à partir du 26 février 2026
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*Prix donné à titre indicatif

N° de stock RS:
768-9035
Référence fabricant:
P0039
Fabricant:
Terasic
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Marque

Terasic

Kit Classification

Adapter Board

Kit Name

SDI to HSMC

Terasic SDI HSMC Board


The Transceiver Serial Digital Interface (SDI) HSMC board provides a hardware platform for developing video broadcasting systems. It is intended to be used by customers to implement and design SDI and AES systems based on transceiver-based host boards with an HSMC interface. It can also be part of an openly sold Development Kit, or bundled with packages of software and IP cores.

2 x SDI transmit (TX) channels with SDI cable tri-speed drivers
2 x SDI receive (RX) channels with SDI cable equalizers
2 x 75Ω BNC SDI TX interfaces
2 x 75Ω BNC SDI RX interfaces
Adjustable 1.1 to 1.8V and standard 3.3V CMOS Input Signal Levels
2 x RS-422 transceivers for AES3 TX and AES3 RX channels
2 x 75Ω BNC AES3 RX interfaces
2 x 75Ω BNC AES3 TX interfaces
High frequency switching regulator for 12V to 5V power supply conversion
3 x linear regulators for 5V to 3.3V low noise power supply conversion
FDTIM analysis for power distribution network (PDN) decoupling
SDI multi-frequency VCXO femto clock video PLL
98.304MHz / 90.3168MHz / 122.88MHz / 112.896MHz voltage-controlled crystal oscillator (VCXO) based phase-locked loop (PLL)
LVPECL differential clock buffer with two differential outputs - HSMC and SMA
4 x digital audio isolation transformers
Multi-format video sync separator
HSMC connector for interface conversion, fully compatible with HSMC host boards

Supplied with

System CD ROM


An FPGA is a semiconductor device consisting of a matrix of Configurable Logic Blocks (CLBs) connected through programmable interconnects. The user determines these interconnections by programming SRAM. A CLB can be simple (AND, OR gates, etc) or complex (a block of RAM). The FPGA allows changes to be made to a design even after the device is soldered into a PCB.

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