TE Connectivity, Z-PACK 1.9 mm Pitch High Speed High Speed Backplane Connector, Right Angle Male, 10 Column, 12 Row, 72

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N° de stock RS:
472-316
Numéro d'article Distrelec:
304-49-463
Référence fabricant:
1934359-1
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

High Speed Backplane Connector

Backplane Connector Type

High Speed

Number of Contacts

72

Current

0.5A

Orientation

Right Angle

Number of Columns

10

Connector Gender

Male

Number of Rows

12

Voltage

250V

Housing Material

Liquid Crystal Polymer

Pitch

1.9mm

Mount Type

Board

Contact Material

Phosphor Bronze

Contact Plating

Gold, Tin

Termination Type

Solder

Minimum Operating Temperature

65°C

Contact Gender

Male

Maximum Operating Temperature

90°C

Standards/Approvals

No

Series

Z-PACK

Pays d'origine :
CN
The TE Connectivity 72 Position High Speed Backplane Connector is designed for superior connectivity and reliability in demanding applications. Featuring nine rows and eight columns, this connector is engineered to facilitate high-speed data transfer while maintaining robust signal integrity. Its right-angle PCB mount header ensures efficient space utilisation, making it ideal for compact electronic designs. With partially shrouded features and precise mating alignment, it provides seamless connections in a variety of environments. The connector’s LCP housing material meets industry standards, ensuring durability while catering to harsh conditions. Its exceptional design also complements differential signalling, offering a sustainable solution for contemporary circuit boards. This product exemplifies innovation and performance in backplane connectivity, meeting the needs of modern electronic applications.

Designed for 10 Gb/s data rates to accommodate high-speed requirements

Compatible with various PCB configurations, enhancing design flexibility

Utilises a guide slot for accurate mating alignment during assembly

Incorporates a partially shrouded style for improved protection and reliability

Constructed from high-quality LCP material, ensuring durability and thermal performance

Features solder mask support to streamline the assembly process

Mechanical attachments that allow for tailored design compatibility

Optimised for differential signalling, enabling effective signal integrity

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