TE Connectivity, Z-PACK 1.9 mm Pitch High Speed High Speed Backplane Connector, Vertical Male, 10 Column, 12 Row, 120

Voir la catégorie

Sous-total (1 tube de 23 unités)*

271,49 €

(TVA exclue)

328,50 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 06 avril 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Tube(s)
le tube
Prix par unité*
1 +271,49 €11,804 €

*Prix donné à titre indicatif

N° de stock RS:
472-314
Numéro d'article Distrelec:
304-63-225
Référence fabricant:
1934312-1
Fabricant:
TE Connectivity
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

TE Connectivity

Backplane Connector Type

High Speed

Product Type

High Speed Backplane Connector

Number of Contacts

120

Current

0.5A

Orientation

Vertical

Number of Columns

10

Voltage

250 V

Connector Gender

Male

Number of Rows

12

Housing Material

Liquid Crystal Polymer

Pitch

1.9mm

Contact Material

Phosphor Bronze

Mount Type

PCB

Contact Plating

Tin, Gold

Termination Type

Solder

Minimum Operating Temperature

65°C

Contact Gender

Male

Maximum Operating Temperature

90°C

Standards/Approvals

No

Series

Z-PACK

Pays d'origine :
CN
The TE Connectivity high-speed backplane connector is specifically designed for demanding electronic applications, ensuring a robust and reliable connection. The product features a carefully engineered design, incorporating 120 positions across 12 rows and 10 columns, perfectly tailored for PCB mounting. The vertical orientation and fully shrouded structure not only offer superior electrical performance but also enhance mechanical strength. With a centreline of 1.9 mm, the connector accommodates high-density layouts, making it ideal for cutting-edge technology environments where space is at a premium. This backplane connector is perfect for signalling applications, achieving impressive data rates of up to 10 Gb/s. Built with the highest compliance standards, it guarantees reliability and efficiency in various conditions.

Designed for high-density applications, minimising PCB footprint

Operates effectively within a broad temperature range, ensuring versatility

Supports differential signalling for enhanced data integrity

Incorporates a traditional backplane architecture for reliable performance

Features a fully shrouded design to protect against environmental factors

Equipped with compliant tail technology for secure PCB attachment

Utilises low halogen materials, promoting eco-friendliness

Liens connexes