TE Connectivity, Z-PACK 1.9 mm Pitch High Speed High Speed Backplane Connector, Vertical Male, 8 Column, 15 Row, 120 Way

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Sous-total (1 tube de 28 unités)*

316,87 €

(TVA exclue)

383,41 €

(TVA incluse)

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  • Expédition à partir du 02 avril 2026
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Tube(s)
le tube
Prix par unité*
1 +316,87 €11,317 €

*Prix donné à titre indicatif

N° de stock RS:
472-295
Numéro d'article Distrelec:
304-49-452
Référence fabricant:
1934271-1
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

High Speed Backplane Connector

Backplane Connector Type

High Speed

Current

0.5A

Number of Contacts

120

Orientation

Vertical

Number of Columns

8

Connector Gender

Male

Voltage

250 V

Number of Rows

15

Housing Material

Liquid Crystal Polymer

Pitch

1.9mm

Mount Type

Board

Contact Material

Phosphor Bronze

Contact Plating

Gold, Tin

Minimum Operating Temperature

65°C

Termination Type

Solder

Contact Gender

Male

Maximum Operating Temperature

90°C

Standards/Approvals

2016, UL 94V-0, UL, China RoHS 2 Directive MIIT Order No 32, EU REACH Regulation (EC) No. 1907/2006, UL E28476, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant

Series

Z-PACK

Pays d'origine :
CN
The TE Connectivity 120 Position High Speed Backplane Connector is expertly engineered to facilitate seamless data transmission in high-performance applications. Designed with 15 rows and 8 columns, this PCB mount header is fully shrouded and features a 1.9 mm centreline, providing reliable connectivity in compact spaces. Its robust construction and impressive specifications ensure optimal signal integrity, making it an ideal choice for traditional backplane architectures. With an operating voltage of 250 VAC and an impedance of 100 Ω, this connector is built to handle demanding electrical environments while maintaining peak performance. Whether used in telecommunications, computing, or industrial systems, this component ensures durability and reliability across various applications, setting a benchmark in connector technology.

Robust construction for maximum durability in various environments

Optimised for high-speed data applications, supporting data rates of up to 10 Gb/s

Differential impedance maintains signal integrity for reliable performance

Vertical PCB mount orientation allows for effective space management

Advanced mating alignment features ensure secure connections during operation

Low halogen content supports environmentally responsible practices

Matte finish plating enhances resistance to wear and tear

Easy integration into traditional backplane architectures for versatile applications

Configured with compliant tail technology for improved retention during assembly

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