Chemtronics Paste Epoxy Adhesive, 20 g
- N° de stock RS:
- 285-7309
- Numéro d'article Distrelec:
- 301-58-528
- Référence fabricant:
- CW2460
- Fabricant:
- Chemtronics
Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau disponible. RS a l'intention de le retirer de son assortiment sous peu.
- N° de stock RS:
- 285-7309
- Numéro d'article Distrelec:
- 301-58-528
- Référence fabricant:
- CW2460
- Fabricant:
- Chemtronics
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Chemtronics | |
| Product Type | Epoxy Adhesive | |
| Application | Bonding | |
| Colour | Grey | |
| Product Form | Paste | |
| Package Size | 20 g | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 150°C | |
| Standards/Approvals | No | |
| Base Chemical | Conductive Epoxy Adhesive | |
| Sélectionner tout | ||
|---|---|---|
Marque Chemtronics | ||
Product Type Epoxy Adhesive | ||
Application Bonding | ||
Colour Grey | ||
Product Form Paste | ||
Package Size 20 g | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 150°C | ||
Standards/Approvals No | ||
Base Chemical Conductive Epoxy Adhesive | ||
Statut RoHS : Exempté
- Pays d'origine :
- US
The Circuit Works 60 Minute Conductive Epoxy is a two-part silver epoxy designed for prototype, repair, and solder-less conductive bonding applications. With strong mechanical bonds, excellent electrical and thermal conductivity, and extended pot life, this epoxy offers increased work time and workability. It adheres aggressively to a wide variety of materials, making it a versatile solution for electronics applications.
Two-component product with simple mixing ratios
60 minute work time offers increased workability and extended pot life
Excellent electrical and thermal conductivity
High strength bond adheres dissimilar surfaces
Static Discharge and Grounding
Conductive Structural Adhesions
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