Bergquist 1600S Series Self-Adhesive Thermal Interface Pad, 0.009 in Thick, 1.6 W/mK, 12 in, 12in, Silicone
- N° de stock RS:
- 282-6863
- Référence fabricant:
- SIL PAD TSP 1600S, 12in x 12in x 0.009 eaac
- Fabricant:
- Bergquist
Sous-total (1 unité)*
51,72 €
(TVA exclue)
62,58 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Temporairement en rupture de stock
- Expédition à partir du 11 décembre 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Unité | Prix par unité |
|---|---|
| 1 + | 51,72 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 282-6863
- Référence fabricant:
- SIL PAD TSP 1600S, 12in x 12in x 0.009 eaac
- Fabricant:
- Bergquist
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Bergquist | |
| Product Type | Thermal Interface Pad | |
| Thickness | 0.009in | |
| Thermal Conductivity | 1.6W/mK | |
| Self-Adhesive | Yes | |
| Trade Name | 1600S | |
| Conductive Material | Silicone | |
| Standards/Approvals | No | |
| Length | 12in | |
| Width | 12in | |
| Series | 1600S | |
| Sélectionner tout | ||
|---|---|---|
Marque Bergquist | ||
Product Type Thermal Interface Pad | ||
Thickness 0.009in | ||
Thermal Conductivity 1.6W/mK | ||
Self-Adhesive Yes | ||
Trade Name 1600S | ||
Conductive Material Silicone | ||
Standards/Approvals No | ||
Length 12in | ||
Width 12in | ||
Series 1600S | ||
Statut RoHS : Exempté
- Pays d'origine :
- US
The Bergquist thermally conductive insulation material is designed for a wide variety of applications requiring high thermal performance and electrical isolation. These applications also typically have low mounting pressures for component clamping. The material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressure.
Electrically isolating
Low mounting pressures
Smooth and highly compliant surface
General-purpose thermal interface material solution
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