Bergquist 6000UL Series Self-Adhesive Thermal Gap Pad, 0.125 in Thick, 6 W/mK, 16 in, 8in, Silicone
- N° de stock RS:
- 282-6792
- Référence fabricant:
- GAP PAD TGP 6000ULM, 16in x 8in x 0.125 sh
- Fabricant:
- Bergquist
Actuellement indisponible
Désolés, nous ne savons pas quand ce produit sera réapprovisionné.
- N° de stock RS:
- 282-6792
- Référence fabricant:
- GAP PAD TGP 6000ULM, 16in x 8in x 0.125 sh
- Fabricant:
- Bergquist
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Bergquist | |
| Product Type | Thermal Gap Pad | |
| Thickness | 0.125in | |
| Thermal Conductivity | 6W/mK | |
| Self-Adhesive | Yes | |
| Conductive Material | Silicone | |
| Length | 16in | |
| Width | 8in | |
| Standards/Approvals | No | |
| Series | 6000UL | |
| Sélectionner tout | ||
|---|---|---|
Marque Bergquist | ||
Product Type Thermal Gap Pad | ||
Thickness 0.125in | ||
Thermal Conductivity 6W/mK | ||
Self-Adhesive Yes | ||
Conductive Material Silicone | ||
Length 16in | ||
Width 8in | ||
Standards/Approvals No | ||
Series 6000UL | ||
Statut RoHS : Exempté
- Pays d'origine :
- US
The Bergquist is an extremely soft gap filling material rated at a thermal conductivity of 6.0 W per mK. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. It is highly conformal, even to surfaces with high roughness or topography, allowing for excellent interfacing and wet-out characteristics.
High-compliance
Low compression stress
Ultra low modulus
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