Bergquist 3500UL Series Self-Adhesive Thermal Gap Pad, 3.1 mm Thick, 3.5 W/mK, Silicone
- N° de stock RS:
- 282-6784
- Référence fabricant:
- GAP PAD TGP 3500ULMG (2166909)
- Fabricant:
- Bergquist
Sous-total (1 unité)*
209,86 €
(TVA exclue)
253,93 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Temporairement en rupture de stock
- Expédition à partir du 30 novembre 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Unité | Prix par unité |
|---|---|
| 1 + | 209,86 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 282-6784
- Référence fabricant:
- GAP PAD TGP 3500ULMG (2166909)
- Fabricant:
- Bergquist
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Bergquist | |
| Product Type | Thermal Gap Pad | |
| Thickness | 3.1mm | |
| Thermal Conductivity | 3.5W/mK | |
| Self-Adhesive | Yes | |
| Conductive Material | Silicone | |
| Standards/Approvals | No | |
| Series | 3500UL | |
| Sélectionner tout | ||
|---|---|---|
Marque Bergquist | ||
Product Type Thermal Gap Pad | ||
Thickness 3.1mm | ||
Thermal Conductivity 3.5W/mK | ||
Self-Adhesive Yes | ||
Conductive Material Silicone | ||
Standards/Approvals No | ||
Series 3500UL | ||
Statut RoHS : Exempté
- Pays d'origine :
- US
The Bergquist is an extremely soft gap filling material with a thermal conductivity of 3.5 W per mK. The material offers exceptional thermal performance at low pressures due to a unique 3.5 W per mK filler package and ultra-low modulus resin formulation. The enhanced material is well suited for high performance applications requiring extremely low assembly stress. It maintains a conformable nature that allows for excellent interfacing and wet out characteristics, even to surfaces with high roughness and or topography.
Fiberglass reinforced for shear and tear resistance
Non-fiberglass option for applications that require an additional reduction in stress
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