Bergquist 2200SF Series Self-Adhesive Thermal Gap Pad, 0.08 in Thick, 2 W/mK, 16 in, 8in, Timber
- N° de stock RS:
- 282-6754
- Référence fabricant:
- GAP PAD TGP 2200SF, 16in x 8in x 0.08 sh
- Fabricant:
- Bergquist
Actuellement indisponible
Désolés, nous ne savons pas quand ce produit sera réapprovisionné.
- N° de stock RS:
- 282-6754
- Référence fabricant:
- GAP PAD TGP 2200SF, 16in x 8in x 0.08 sh
- Fabricant:
- Bergquist
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Bergquist | |
| Product Type | Thermal Gap Pad | |
| Thickness | 0.08in | |
| Thermal Conductivity | 2W/mK | |
| Self-Adhesive | Yes | |
| Conductive Material | Timber | |
| Width | 8in | |
| Standards/Approvals | No | |
| Length | 16in | |
| Series | 2200SF | |
| Sélectionner tout | ||
|---|---|---|
Marque Bergquist | ||
Product Type Thermal Gap Pad | ||
Thickness 0.08in | ||
Thermal Conductivity 2W/mK | ||
Self-Adhesive Yes | ||
Conductive Material Timber | ||
Width 8in | ||
Standards/Approvals No | ||
Length 16in | ||
Series 2200SF | ||
Statut RoHS : Exempté
- Pays d'origine :
- US
The Bergquist Silicone-Free Formulation, High Performance Thermally Conductive Material. It is a high performance, 2.0 W/m-K, thermally conductive gap filling material. The compound is silicone free by design and offers exceptionally low interfacial resistances to adjacent surfaces.
Silicone-free formulation
Minimal compression set
0.5 mil film provides tack free surface
Tacky side allows for ease of handling and placement
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