Bergquist Gap Pad 3000S30 Series Self-Adhesive Thermal Pad, 0.5 mm Thick, 3 W/mK, 100 mm, 100mm, Fibreglass Reinforced
- N° de stock RS:
- 711-030
- Référence fabricant:
- 2165471
- Fabricant:
- Bergquist
Sous-total (1 paquet de 32 unités)*
403,40 €
(TVA exclue)
488,11 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Stocké-e par le fabricant
- Prêt à être expédié à partir du 09 novembre 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Paquet(s) | le paquet | Prix par unité* |
|---|---|---|
| 1 + | 403,40 € | 12,606 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 711-030
- Référence fabricant:
- 2165471
- Fabricant:
- Bergquist
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Bergquist | |
| Product Type | Thermal Pad | |
| Thickness | 0.5mm | |
| Thermal Conductivity | 3W/mK | |
| Self-Adhesive | Yes | |
| Thermal Impedance | 0.25°C-in²/W | |
| Hardness | 30 Shore 00 | |
| Conductive Material | Fibreglass Reinforced Polymer | |
| Length | 100mm | |
| Standards/Approvals | RoHS | |
| Width | 100mm | |
| Colour | Light Blue | |
| Series | Gap Pad 3000S30 | |
| Minimum Operating Temperature | -60°C | |
| Maximum Operating Temperature | 200°C | |
| Sélectionner tout | ||
|---|---|---|
Marque Bergquist | ||
Product Type Thermal Pad | ||
Thickness 0.5mm | ||
Thermal Conductivity 3W/mK | ||
Self-Adhesive Yes | ||
Thermal Impedance 0.25°C-in²/W | ||
Hardness 30 Shore 00 | ||
Conductive Material Fibreglass Reinforced Polymer | ||
Length 100mm | ||
Standards/Approvals RoHS | ||
Width 100mm | ||
Colour Light Blue | ||
Series Gap Pad 3000S30 | ||
Minimum Operating Temperature -60°C | ||
Maximum Operating Temperature 200°C | ||
Statut RoHS : Exempté
- Pays d'origine :
- US
The Bergquist Gap Pad provides exceptional thermal performance for low-stress applications, making it an Ideal solution for heat management in sensitive electronic assemblies.
Rated thermal conductivity of 3.0 W/m-K for efficient heat transfer
Fiberglass reinforcement enhances puncture and tear resistance
Designed for low-pressure applications with low thermal resistance
Natural inherent tack on both sides simplifies assembly without additional adhesives
Liens connexes
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