Infineon SRAM, CY62128ELL-45ZXIT- 1024 kB
- N° de stock RS:
- 198-7990
- Référence fabricant:
- CY62128ELL-45ZXIT
- Fabricant:
- Infineon
Offre groupée disponible
Consulter les options de prix de grosSous-total (1 paquet de 5 unités)*
11,34 €
(TVA exclue)
13,72 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Temporairement en rupture de stock
- Expédition à partir du 16 novembre 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Unité | Prix par unité | le paquet* |
|---|---|---|
| 5 - 45 | 2,268 € | 11,34 € |
| 50 - 95 | 2,012 € | 10,06 € |
| 100 - 245 | 1,792 € | 8,96 € |
| 250 - 495 | 1,732 € | 8,66 € |
| 500 + | 1,666 € | 8,33 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 198-7990
- Référence fabricant:
- CY62128ELL-45ZXIT
- Fabricant:
- Infineon
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Infineon | |
| Memory Size | 1024kB | |
| Product Type | SRAM | |
| Organisation | 128k x 8 | |
| Number of Words | 128k | |
| Number of Bits per Word | 8 | |
| Minimum Operating Temperature | -65°C | |
| Pin Count | 32 | |
| Maximum Operating Temperature | 150°C | |
| Standards/Approvals | RoHS | |
| Sélectionner tout | ||
|---|---|---|
Marque Infineon | ||
Memory Size 1024kB | ||
Product Type SRAM | ||
Organisation 128k x 8 | ||
Number of Words 128k | ||
Number of Bits per Word 8 | ||
Minimum Operating Temperature -65°C | ||
Pin Count 32 | ||
Maximum Operating Temperature 150°C | ||
Standards/Approvals RoHS | ||
Infineon SRAM, 1024kB Memory Size, 128k x 8 Organisation - CY62128ELL-45ZXIT
This SRAM is a static memory device designed to provide fast volatile data storage for embedded systems operating across extreme temperatures. It is intended for applications that require byte-wide access with compact addressable capacity and a mid-range pin count, suitable for environments where wide thermal tolerance and industry-standard interoperability are required.
Features and Benefits:
• 1024 kB capacity offers substantial on-chip working storage
• 8-bit organisation enables straightforward byte-wise data access
• 128k words allow deterministic address mapping for firmware
• 32-pin package supports standard board-level integration
• Operable from -65°C to 150°C endures extreme thermal cycles
• RoHS conformity simplifies regulatory material management
• 8-bit organisation enables straightforward byte-wise data access
• 128k words allow deterministic address mapping for firmware
• 32-pin package supports standard board-level integration
• Operable from -65°C to 150°C endures extreme thermal cycles
• RoHS conformity simplifies regulatory material management
Applications
• Suitable for aerospace control modules with thermal stress
• Ideal for industrial controllers in high-temperature sites
• Used with automotive systems requiring compact volatile RAM
• Can be used for radiation-tolerant avionics data buffering
• Used for embedded low-power 8-bit processing tasks
• Ideal for industrial controllers in high-temperature sites
• Used with automotive systems requiring compact volatile RAM
• Can be used for radiation-tolerant avionics data buffering
• Used for embedded low-power 8-bit processing tasks
How is data accessed within the device at system level?
Memory is organised as 128k words of 8 bits, enabling byte-wise read and write operations via the 32 external pins for address, data and control signalling.
What thermal range can the module reliably handle during operation?
It is rated to operate continuously from -65°C up to 150°C, permitting use in both cryogenic and high-temperature industrial scenarios.
Does the device retain information when power is removed?
No, it is a volatile memory type and loses stored data when supply power is removed.
What packaging considerations affect board designers?
The 32-pin footprint requires matched routing for address and data lines and consideration of thermal dissipation when used in elevated-temperature assemblies.
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