Weller Wire, 0.8 mm Lead Free Solder, 217 °C Melting Point

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Sous-total (1 bobine de 1 unité)*

55,39 €

(TVA exclue)

67,02 €

(TVA incluse)

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  • Plus 23 unité(s) expédiée(s) à partir du 20 juillet 2026
  • Plus 15 unité(s) expédiée(s) à partir du 22 juillet 2026
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Bobine(s)
la bobine
1 - 955,39 €
10 - 1953,17 €
20 - 4951,52 €
50 +49,34 €

*Prix donné à titre indicatif

N° de stock RS:
788-3726
Référence fabricant:
T0051388799
Fabricant:
Weller
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Marque

Weller

Product Type

Lead Free Solder

Wire Diameter

0.8mm

Percent Lead

0%

Product Form

Wire

Melting Point

217°C

Percent Silver

3%

Percent Tin

96.5%

Flux Type

Rosin

Product Weight

250g

Percent Copper

0.5%

Standards/Approvals

No

Pays d'origine :
JP

Weller Lead Free Solder, 0.8mm Wire Diameter, 250g Product Weight - T0051388799


This lead-free solder is a wire-form alloy designed for Electronic Assembly and repair, providing a rosin-fluxed option for controlled soldering on electrical and mechanical assemblies. It operates as a low-oxide, tin-rich solder for general-purpose joining of components where lead-free materials are required.

Features and Benefits:


• 0.8mm wire diameter for precise hand and machine feeding
• 96.5% tin composition enabling solid wetting performance
• 3% silver content improving joint strength and fatigue resistance
• 0.5% copper addition reducing solder joint voiding
• 217°C melting point allowing predictable thermal profiling
• 250 g spool size supporting medium-volume workstation use

Applications


• Suitable for through-hole component soldering in control boards
• Ideal for rework and repair of electronic assemblies
• Used with pick-and-place solder feeders for small-batch production
• Can be used for assembly of sensor modules in automation systems
• Suitable for soldering connectors and cable terminations in electrical panels

What fluxing behaviour should I expect during soldering?


The built-in rosin flux promotes stable flux activity at typical reflow and hand-solder temperatures, aiding solder flow and reducing oxide formation at joints.

How does the alloy composition influence thermal cycling performance?


The silver content increases creep resistance while the high tin fraction maintains good wetting, together producing joints that better withstand repeated temperature variation.

Which soldering processes is this wire compatible with?


It is compatible with manual iron soldering and most wave and selective soldering processes when used with appropriate thermal profiles.

How should an unused spool be stored between uses?


Keep the spool dry and sealed from contaminants

ambient storage away from corrosive atmospheres preserves flux activity and the alloy’s surface condition.

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