Weller Wire, 1 mm Lead Free Solder, 217 °C Melting Point
- N° de stock RS:
- 788-3723
- Numéro d'article Distrelec:
- 110-64-779
- Référence fabricant:
- T0051388699
- Fabricant:
- Weller
Offre groupée disponible
Consulter les options de prix de grosSous-total (1 bobine de 1 unité)*
68,96 €
(TVA exclue)
83,44 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
En stock
- Plus 1 unité(s) expédiée(s) à partir du 20 juillet 2026
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Bobine(s) | la bobine |
|---|---|
| 1 - 9 | 68,96 € |
| 10 - 19 | 66,21 € |
| 20 - 49 | 64,14 € |
| 50 + | 61,94 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 788-3723
- Numéro d'article Distrelec:
- 110-64-779
- Référence fabricant:
- T0051388699
- Fabricant:
- Weller
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Weller | |
| Product Type | Lead Free Solder | |
| Wire Diameter | 1mm | |
| Percent Lead | 0% | |
| Product Form | Wire | |
| Melting Point | 217°C | |
| Percent Silver | 3% | |
| Percent Tin | 96.5% | |
| Flux Type | Rosin | |
| Product Weight | 250g | |
| Percent Copper | 0.5% | |
| Standards/Approvals | No | |
| Sélectionner tout | ||
|---|---|---|
Marque Weller | ||
Product Type Lead Free Solder | ||
Wire Diameter 1mm | ||
Percent Lead 0% | ||
Product Form Wire | ||
Melting Point 217°C | ||
Percent Silver 3% | ||
Percent Tin 96.5% | ||
Flux Type Rosin | ||
Product Weight 250g | ||
Percent Copper 0.5% | ||
Standards/Approvals No | ||
- Pays d'origine :
- JP
Weller Lead Free Solder, 1mm Wire Diameter, 250g Product Weight - T0051388699
This lead-free solder is a rosin-flux cored wire designed for Electronic Assembly and repair in industrial environments. It provides a reliable filler metal for joining electrical and electronic components where lead avoidance is required, and is supplied on a 250 g spool for workshop use.
Features and Benefits:
• 1mm wire diameter enables controlled feed in automated dispensers
• 96.5% tin composition ensures predictable wetting behaviour
• 3% silver content improves joint ductility and fatigue resistance
• 0.5% copper reduces whisker propensity and enhances mechanical strength
• 217 °C melting point allows consistent reflow across typical soldering irons
• Rosin flux core yields low-residue flux deposition after soldering
• 96.5% tin composition ensures predictable wetting behaviour
• 3% silver content improves joint ductility and fatigue resistance
• 0.5% copper reduces whisker propensity and enhances mechanical strength
• 217 °C melting point allows consistent reflow across typical soldering irons
• Rosin flux core yields low-residue flux deposition after soldering
Applications
• Suitable for hand soldering and automated wave or selective soldering
• Ideal for through-hole and SMT repairs on electronic assemblies
• Used for joining silver-bearing component leads in control systems
• Can be used for maintenance of electrical modules in automation equipment
• Ideal for through-hole and SMT repairs on electronic assemblies
• Used for joining silver-bearing component leads in control systems
• Can be used for maintenance of electrical modules in automation equipment
What spool weight should I expect for routine workshop stocking?
The product is supplied as a 250 g spool appropriate for small to medium repair batches.
How does the alloy composition affect thermal cycling performance?
The tin-rich alloy with 3% silver improves joint resilience under repeated temperature changes compared with pure-tin solders.
Is the flux type suitable for delicate electronics with minimal cleaning?
The rosin flux core produces low residues compatible with many electronics tasks where limited post-solder cleaning is performed.
What soldering temperature should be targeted to ensure proper joint formation?
Aim to heat the joint above the 217 °C melting point with sufficient thermal mass to wet pads and leads without prolonged dwell.