Infineon BGS12P2L6E6327XTSA1 RF Switch Circuit, 6-Pin TSLP

Sous-total (1 paquet de 50 unités)*

11,45 €

(TVA exclue)

13,85 €

(TVA incluse)

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50 +0,229 €11,45 €

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N° de stock RS:
222-4776
Référence fabricant:
BGS12P2L6E6327XTSA1
Fabricant:
Infineon
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Marque

Infineon

Technology

RF MOS Power Switch

Product Type

RF Switch Circuit

Sub Type

SPDT General Purpose Switch

Package Type

TSLP

Pin Count

6

Mount Type

Surface

Operating Band 1 Frequency

50MHz

Operating Band 2 Frequency

6GHz

Minimum Supply Voltage

1.65V

Maximum Supply Voltage

3.4V

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

85°C

Series

BGS12P2L6

Height

310μm

Standards/Approvals

RoHS and WEEE

Length

700μm

Width

1.1mm

Number of Operating Bands

2

Automotive Standard

No

Infineon BGS12P2L6 Series RF Switch Circuit, 3.4V Maximum Supply Voltage, 50MHz–6GHz Operating Band - BGS12P2L6E6327XTSA1


This RF switch circuit is a surface-mounted single-pole double-throw MOS power switch designed for routing RF signals across a wide frequency range in Compact electronic assemblies. It operates from low-voltage supplies and is intended for general-purpose switching in wireless and wideband RF designs where a small-footprint, low-profile component is required.

Features and Benefits:


• Operates across two frequency bands for wideband signal routing
• Accepts supply voltages from 1.65V to 3.4V for flexible power designs
• SPDT configuration provides straightforward single-input switching
• Six pins simplify PCB integration and reduce routing complexity
• Low-profile 0.31mm height supports slim form-factor assemblies

Applications


• Suitable for handheld wireless transceivers and radios
• Ideal for antenna selection in Compact devices
• Used for routing RF signals between front-end modules
• Can be used for testbench switching between 50 MHz and 6 GHz
• Appropriate for portable communications and IoT devices

What operating temperature range can it withstand?


It functions between -40°C and 85°C for typical environmental conditions.

What packaging and mounting should be planned for PCB layout?


It is supplied in a TSLP package intended for surface mounting on standard assemblies.

Are there any environmental disposal standards applicable?


The component meets RoHS and WEEE directives for material restrictions and end-of-life handling.

Is this switch specified for automotive qualification?


It is not intended for automotive-grade applications as automotive standard compliance is not provided.

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