STMicroelectronics RF Transceiver, 6-Pin Bumpless CSP
- N° de stock RS:
- 192-3828
- Référence fabricant:
- MLPF-WB55-01E3
- Fabricant:
- STMicroelectronics
Sous-total (1 bobine de 5000 unités)*
835,00 €
(TVA exclue)
1 010,00 €
(TVA incluse)
Ajouter 5000 unités pour bénéficier d'une livraison gratuite
Temporairement en rupture de stock
- Expédition à partir du 17 juin 2026
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Unité | Prix par unité | la bobine* |
|---|---|---|
| 5000 + | 0,167 € | 835,00 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 192-3828
- Référence fabricant:
- MLPF-WB55-01E3
- Fabricant:
- STMicroelectronics
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | STMicroelectronics | |
| Product Type | RF Transceiver | |
| Technology | IPD on Non-Conductive Glass Substrate | |
| Sub Type | RF Transceiver | |
| Package Type | Bumpless CSP | |
| Pin Count | 6 | |
| Mount Type | Surface | |
| Operating Band 1 Frequency | 2500MHz | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | ECOPACK2 | |
| Width | 1.6 mm | |
| Length | 1.63mm | |
| Series | MLPF-WB55 | |
| Number of Operating Bands | 1 | |
| Automotive Standard | No | |
| Sélectionner tout | ||
|---|---|---|
Marque STMicroelectronics | ||
Product Type RF Transceiver | ||
Technology IPD on Non-Conductive Glass Substrate | ||
Sub Type RF Transceiver | ||
Package Type Bumpless CSP | ||
Pin Count 6 | ||
Mount Type Surface | ||
Operating Band 1 Frequency 2500MHz | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals ECOPACK2 | ||
Width 1.6 mm | ||
Length 1.63mm | ||
Series MLPF-WB55 | ||
Number of Operating Bands 1 | ||
Automotive Standard No | ||
- Pays d'origine :
- CN
The MLPF-WB55-01E3 integrates an impedance matching network and harmonics filter. The matching impedance network has been tailored to maximize the RF performance of STM32WB55xx. This device uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.
Integrated impedance matching to STM32WB55Cx and STM32WB55Rx
LGA footprint compatible
50 Ω nominal impedance on antenna side
Deep rejection harmonics filter
Low insertion loss
Small footprint
Low thickness ≤ 450 μm
High RF performance
RF BOM and area reduction
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