Phoenix Contact Polycarbonate Raspberry Pi Case for use with Raspberry Pi Printed-circuit Boards in Light Grey

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Sous-total (1 unité)*

39,42 €

(TVA exclue)

47,70 €

(TVA incluse)

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  • Expédition à partir du 10 avril 2026
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Prix par unité
1 - 439,42 €
5 +38,23 €

*Prix donné à titre indicatif

N° de stock RS:
521-335
Référence fabricant:
1139227
Fabricant:
Phoenix Contact
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Marque

Phoenix Contact

Product Type

Raspberry Pi Case

For Use With

Raspberry Pi Printed-circuit Boards

Series

UCS

Colour

Light Grey

Body Material

Polycarbonate

Standards/Approvals

IEC 60695-2-11:2014-02, IEC 60068-2-27:2008-02, IEC 60695-10-2:2014-02, IEC 60068-2-31:2008-05, IEC 60068-2-6:2007-12, UL Approval ID:E240868, VW PV 3.10.7:2005-02, IEC 60529:1989-11+AMD 1:1999-11+AMD 2:2013-08, UL 94 V0, IEC 60112

Height

87mm

Length

125mm

Width

125 mm

Pays d'origine :
DE
The Phoenix Contact universal housing has been expertly designed to accommodate Raspberry Pi printed-circuit boards, providing a robust and practical solution for safeguarding electronic components. It features half shells and side panels that are precisely cut to allow for all pertinent connections, ensuring seamless integration. The housing is crafted in a light grey tone with attractive turquoise-blue corner inlays, which not only enhances its aesthetic appeal but also facilitates easy identification in various setups. Built for versatility, this housing allows for flexible installation and can be customised to meet specific project requirements, making it an ideal choice for many applications. The meticulous attention to detail ensures that not only does it protect the electronics within, but also allows for easy assembly and maintenance, establishing it as a dependable option for anyone working with Raspberry Pi technology.

Modular design allows for high application flexibility

Customisation options enhance the adaptability of the housing

User friendly assembly process with easy access to all connections

Robust construction for reliable protection in various environments

Compatible with multiple form factors for increased versatility

Efficient heat dissipation helps maintain optimal operating conditions

Vertical mounting capability for efficient space utilisation

Includes adhesive pads for secure PCB attachment

Liens connexes

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