STMicroelectronics Demonstration Board for VNI8200XP for High Side Driver
- N° de stock RS:
- 196-1763
- Référence fabricant:
- STEVAL-IFP022V1
- Fabricant:
- STMicroelectronics
Sous-total (1 unité)*
84,88 €
(TVA exclue)
102,70 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Pénurie d'approvisionnement
- Plus 3 unité(s) expédiée(s) à partir du 09 décembre 2025
Notre stock actuel est limité et nos fournisseurs s'attendent à des pénuries.
Unité | Prix par unité |
|---|---|
| 1 + | 84,88 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 196-1763
- Référence fabricant:
- STEVAL-IFP022V1
- Fabricant:
- STMicroelectronics
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | STMicroelectronics | |
| For Use With | High Side Driver | |
| Kit Classification | Evaluation Board | |
| Featured Device | VNI8200XP | |
| Kit Name | Demonstration Board | |
| Sélectionner tout | ||
|---|---|---|
Marque STMicroelectronics | ||
For Use With High Side Driver | ||
Kit Classification Evaluation Board | ||
Featured Device VNI8200XP | ||
Kit Name Demonstration Board | ||
- Pays d'origine :
- IT
The STEVAL-IFP022V1 demonstration board is based on VNI8200XP high-side driver. It was developed as an instrument to test device functionality in terms of power management and digital interface. The boards isolated interface between the IPS and host controller were implemented using high-speed opto-couplers for IPS driving, and low-speed opto-couplers to receive device status information. The connection is achieved through a 30-pin connector.
To provide a user-friendly way to test VNI8200XP device functionality, a GUI interface was developed. To use the GUI it is necessary to connect the STEVAL-IFP022V1 demonstration board to a PC by using a communication board.
Thermal performance is improved thanks to a four-layer structure which makes it possible to design a copper area distributed in all the layers for more effective heat dissipation.
To provide a user-friendly way to test VNI8200XP device functionality, a GUI interface was developed. To use the GUI it is necessary to connect the STEVAL-IFP022V1 demonstration board to a PC by using a communication board.
Thermal performance is improved thanks to a four-layer structure which makes it possible to design a copper area distributed in all the layers for more effective heat dissipation.
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