MG Chemicals 832C-375ML Epoxy Resin Adhesive, 375 ml

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41,24 €

(TVA exclue)

49,90 €

(TVA incluse)

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Prix par unité
1 - 541,24 €
6 - 1439,59 €
15 +38,76 €

*Prix donné à titre indicatif

N° de stock RS:
918-4986
Référence fabricant:
832C-375ML
Fabricant:
MG Chemicals
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Marque

MG Chemicals

Product Type

Epoxy Resin Adhesive

Standards/Approvals

No

Package Size

375 ml

Pays d'origine :
CA

MG Chemicals Epoxy Potting Compounds


The MG Chemicals two-part epoxy potting compound has been designed to protect your electronic components. The liquid electric grade 832 series epoxy protects your components against static discharges, fungus, thermal shocks, mechanical impact and vibrations.

Feature and Benefits


Impact resistant

Non-conductive

Low toxicity

Improves reliability and operational range

Non-porous, water and chemical resistant

Hard to remove

Available in different colours

Typical Applications


Aviation Industry

Communication Industry

Marine Industry

Car industry

Potting Compounds


The Potting Compounds are pourable two-part compounds for potting and encapsulating electronic circuits and components. They protect against moisture and corrosion and improve insulation resistance and mechanical strength. They may be cured at room temperature, or oven cured. Use silicone oil aerosol as a mould release agent. Full instructions supplied with each pack.

Note

Refer to the datasheet for more details on how to apply and applications

Caution

Due to exothermic reaction, heat cure temperatures should be at least 25% below the maximum temperature tolerated by the most fragile PCB component. For larger potting blocks, reduce heat cure temperature by greater margins

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