Molex zSFP+ I/O Connector Receptacle 4-Port 80-Position, 171224-2015

The Molex zSFP+ Stacked Ganged Assembly with Metal Spring Fingers provides a robust solution for high-speed interconnection needs. Designed for Module to Board applications this product features an innovative 2-by-2 layout with three light pipes and 80 circuits ensuring effective performance and reliability. Its sturdy construction incorporates high-performance alloy metal and high-temperature thermoplastic providing durability and exceptional signal integrity. This assembly not only meets stringent compliance standards but also supports a maximum data rate of 28.0 Gbps positioning it as an ideal choice for demanding environments where performance is paramount.

Supports a maximum current of 0.5A per contact which enhancing electrical efficiency
Durable design with up to 100 mating cycles which ensuring longevity in high-use scenarios
Black resin colour offers a sleek appearance while maintaining functionality
Right-angle orientation optimises PCB space and improves installation flexibility
Shielded design equipped with EMI fingers reduces electromagnetic interference for clearer signals
Compliant with industry standards such as EU RoHS which ensuring safety and environmental responsibility
Recommended PCB thickness of 1.57mm providing guidance for optimal installation
Polarised to both mating part and PCB preventing incorrect connections for reliability