Molex PCB Header 8-Position, 53988-0619
- N° de stock RS:
- 520-592
- Référence fabricant:
- 53988-0619
- Fabricant:
- Molex
Sous-total (1 paquet de 30 unités)*
185,82 €
(TVA exclue)
224,84 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 27 janvier 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Paquet(s) | le paquet | Prix par unité* |
|---|---|---|
| 1 + | 185,82 € | 6,194 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 520-592
- Référence fabricant:
- 53988-0619
- Fabricant:
- Molex
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Molex | |
| Type | PCB Header | |
| Body Orientation | Vertical | |
| Number of Contacts | 8 | |
| Contact Material | Tin | |
| Sélectionner tout | ||
|---|---|---|
Marque Molex | ||
Type PCB Header | ||
Body Orientation Vertical | ||
Number of Contacts 8 | ||
Contact Material Tin | ||
- Pays d'origine :
- JP
The TE Connectivity C-Grid header represents innovative design and engineering excellence, ideal for high-temperature applications. Crafted with precision, this high-performance component features a dual-row, through-hole configuration that simplifies PCB integration while ensuring reliable signal transmission. With eight circuits, it is designed for versatility in various wire-to-board applications. The header's tin plating enhances conductivity and durability, making it a dependable choice for PCB headers and receptacles. Its high-temperature thermoplastic construction guarantees resilience under challenging operational conditions, while the thoughtful design allows for secure and faultless mating with compatible parts. Experience confidence in your connectivity with this robust solution, engineered to meet the rigorous demands of modern electronic systems.
Dual-row configuration enhances space efficiency on PCBs
Constructed from high-temperature materials for reliability
Tin plating provides superior conductivity and corrosion resistance
Designed for ease of assembly in various applications
Fully shrouded design ensures secure mating and protection against misalignment
Compliant with industry standards, ensuring a reliable connection
Lightweight construction optimises overall designs without compromising strength
Offers flexibility for a variety of signal and power needs
Constructed from high-temperature materials for reliability
Tin plating provides superior conductivity and corrosion resistance
Designed for ease of assembly in various applications
Fully shrouded design ensures secure mating and protection against misalignment
Compliant with industry standards, ensuring a reliable connection
Lightweight construction optimises overall designs without compromising strength
Offers flexibility for a variety of signal and power needs
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