TE Connectivity QSFP Cage Assembly, 2170754-3
- N° de stock RS:
- 467-562
- Référence fabricant:
- 2170754-3
- Fabricant:
- TE Connectivity
Sous-total (1 plateau de 8 unités)*
188,70 €
(TVA exclue)
228,33 €
(TVA incluse)
Informations sur le stock actuellement non accessibles
Plateau(x) | le plateau | Prix par unité* |
|---|---|---|
| 1 + | 188,70 € | 23,588 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 467-562
- Référence fabricant:
- 2170754-3
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Form Factor | QSFP | |
| Type | Cage Assembly | |
| Number of Ports | 1 | |
| Body Orientation | Straight | |
| Contact Material | Tin | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Form Factor QSFP | ||
Type Cage Assembly | ||
Number of Ports 1 | ||
Body Orientation Straight | ||
Contact Material Tin | ||
- Pays d'origine :
- CN
The TE Connectivity Cage Assembly is a robust and versatile interconnect solution designed to meet the demanding needs of modern networking applications. This innovative product combines performance with reliability, supporting data rates of up to 28 Gb/s while maintaining an impressive operating temperature range of -40 to 85 °C. Its sealable design ensures optimal protection against environmental elements, making it ideal for use in various settings. The cage assembly is crafted from high-quality nickel silver, complemented by an anodised black heat sink, enhancing both performance and durability. With its compact form factor and efficient layout, this device facilitates seamless integration within existing infrastructures, advancing your connectivity strategy through reliable pluggable I/O solutions.
Ganged cage type allows for efficient use of space
Heat sink included to ensure optimal thermal performance
Designed specifically for signal applications to enhance connectivity
Compatible with SFP+ stacked configurations for versatile deployment
Elastomeric gasket provides EMI containment for improved reliability
Box and tray packaging method ensures safe delivery and handling
Recommended PCB thickness simplifies setup and installation
Heat sink included to ensure optimal thermal performance
Designed specifically for signal applications to enhance connectivity
Compatible with SFP+ stacked configurations for versatile deployment
Elastomeric gasket provides EMI containment for improved reliability
Box and tray packaging method ensures safe delivery and handling
Recommended PCB thickness simplifies setup and installation
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