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Siemens SIMATIC ET 200SP Series PLC CPU, 20-Input20 Outputs

N° de stock RS:: 282-4695
Référence fabricant:: 6ES7514-2SN03-0AB0
Fabricant:: Siemens

Siemens SIMATIC ET 200SP Series PLC CPU, 20-Input20 Outputs

Sous-total (1 unité)*

2 833,84 €

(TVA exclue)

3 428,95 €

(TVA incluse)

Frais de livraison offerts pour toute commande de plus de 90,00 €

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Plus 8 unité(s) expédiée(s) à partir du 04 juin 2026
Plus 3 unité(s) expédiée(s) à partir du 10 juin 2026
Plus 3 unité(s) expédiée(s) à partir du 08 juillet 2026

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1 +	2 833,84 €

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N° de stock RS:: 282-4695
Référence fabricant:: 6ES7514-2SN03-0AB0
Fabricant:: Siemens

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Détails du produit

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Sélectionner tout	Attribut	Valeur
	Marque	Siemens
	Product Type	PLC CPU
	Series	SIMATIC ET 200SP
	Number of Inputs	20
	Number of Outputs	20
	Minimum Operating Temperature	-30°C
	Maximum Operating Temperature	60°C
	Standards/Approvals	UKCA, UL, WEEE, ATEX, ABS, IECEX, KR, LRS, Profibus, REACH RoHS, DNV, CE, BV, RINA, TUV
	Depth	75mm
	Length	75mm
	Width	100mm
	Better World Product	Yes
	Better World Claim	Low Carbon Manufacture, Saves Energy
	Program Capacity	900kB
	Programming Language Used	CFC, FBD, Graph, LAD, SCL, STL
	Supply Voltage	24V
	Communication Port Type	PROFINET IRT
	Number of Communication Ports	2

	Sélectionner tout
	Marque Siemens
	Product Type PLC CPU
	Series SIMATIC ET 200SP
	Number of Inputs 20
	Number of Outputs 20
	Minimum Operating Temperature -30°C
	Maximum Operating Temperature 60°C
	Standards/Approvals UKCA, UL, WEEE, ATEX, ABS, IECEX, KR, LRS, Profibus, REACH RoHS, DNV, CE, BV, RINA, TUV
	Depth 75mm
	Length 75mm
	Width 100mm
	Better World Product Yes
	Better World Claim Low Carbon Manufacture, Saves Energy
	Program Capacity 900kB
	Programming Language Used CFC, FBD, Graph, LAD, SCL, STL
	Supply Voltage 24V
	Communication Port Type PROFINET IRT
	Number of Communication Ports 2

Pays d'origine :: DE

Siemens SIMATIC ET 200SP Series PLC CPU, 900kB Program Capacity, 2 Communication Ports - 6ES7514-2SN03-0AB0

This plc cpu provides deterministic control and communication for industrial automation networks, enabling real-time data exchange and programme execution within distributed I/O architectures. It is intended for use in demanding environments where precise cyclic communication and a Compact footprint are required, integrating into PROFINET-based systems and supporting structured programming for complex logic.

Features and Benefits:

• Dual PROFINET IRT ports enable synchronised network communication
• 20 inputs and 20 outputs support moderate I/O density
• 900kB programme capacity allows sizeable control logic storage
• Supports CFC FBD SCL LAD STL for flexible programming approaches
• Wide ambient range from -30°C to 60°C permits harsh-environment operation

Applications

• Suitable for machine control requiring synchronised PROFINET communication
• Ideal for modular assembly lines with mid-range I/O requirements
• Used with hazardous-area installations where ATEX certification is required
• Can be used for marine or offshore automation systems needing class approvals
• Suitable for retrofit projects demanding compact, industrial CPUs

How many communication interfaces are provided for network redundancy?

It offers two physical communication ports to support redundant or segmented PROFINET connections.

What approvals ensure use in regulated industrial sectors?

The unit holds multiple safety and conformity approvals including UKCA, CE, UL, IECEx and other classification society recognitions.

What programming paradigms can be applied for control logic development?

Control programmes may be developed using function block, ladder, structured text, continuous function chart and statement list methodologies.

How Compact is the device for integration into space‑constrained control panels?

The enclosure depth and width are designed for Compact mounting with a small form factor suited to dense panel layouts.

What environmental condition should be considered for outdoor installations?

It is specified for operation across a temperature span down to -30°C and up to 60°C, informing enclosure and thermal management choices.