Adaptive Peltier Module, 19.2W, 8A, 3.8V, 30 x 30mm
- N° de stock RS:
- 490-1288
- Référence fabricant:
- ET-031-20-25-RS
- Fabricant:
- Adaptive
Visuel non contractuel
Actuellement indisponible
Désolés, nous ne savons pas quand ce produit sera réapprovisionné.
- N° de stock RS:
- 490-1288
- Référence fabricant:
- ET-031-20-25-RS
- Fabricant:
- Adaptive
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Adaptive | |
| Maximum Cooling Capacity | 19.2W | |
| Maximum Temperature Difference | +75K | |
| Maximum Current | 8A | |
| Maximum Voltage | 3.8V | |
| Active Area | 30 x 30mm | |
| Active Area Length | 30mm | |
| Active Area Thickness | 5.6mm | |
| Active Area Width | 30mm | |
| Sélectionner tout | ||
|---|---|---|
Marque Adaptive | ||
Maximum Cooling Capacity 19.2W | ||
Maximum Temperature Difference +75K | ||
Maximum Current 8A | ||
Maximum Voltage 3.8V | ||
Active Area 30 x 30mm | ||
Active Area Length 30mm | ||
Active Area Thickness 5.6mm | ||
Active Area Width 30mm | ||
- Pays d'origine :
- CN
Thermoelectric Cooler Modules, Adaptive
The Thermoelectric modules utilise the Peltier phenomenon principle to pump heat when voltage is applied.
Effective cooling power from mW to a hundred of Watts
Max hot side temperature Th = 90°C for best long term performance
Modules can be bonded using heat sink bonder
Applications in refrigeration and power generation
Silicone sealed options
Max hot side temperature Th = 90°C for best long term performance
Modules can be bonded using heat sink bonder
Applications in refrigeration and power generation
Silicone sealed options
Thermoelectric Modules - Peltier Effect
A range of semiconductor thermoelectric devices working on the Peltier effect. When supplied with a suitable electric current, they can either cool or heat. When subject to an externally applied temperature gradient these devices will generate a small amount of electrical power.The larger devices can be used for cooling or controlling the temperature of sub-assemblies. The small size of the mini module makes it ideally suited for cooling miniature electronic components such as infra-red detector chips, microwave IC's, fibre-optic lasers and detectors.,Alternatively, it may be used to minimise the effects of temperature coefficients on oscillator stability, reference voltages, amplifier offsets etc. by providing temperature control.
Solid-state long term stability
Generates no acoustic noise
Generates no acoustic noise