Samtec SEAF Series Straight Surface PCB Socket, 160-Contact, 8 Row, 1.27 mm Pitch Solder

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Sous-total (1 unité)*

16,36 €

(TVA exclue)

19,80 €

(TVA incluse)

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1 - 1916,36 €
20 - 7413,59 €
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600 +11,56 €

*Prix donné à titre indicatif

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N° de stock RS:
767-8956
Référence fabricant:
SEAF-20-05.0-S-08-2-A-K-TR
Fabricant:
Samtec
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Marque

Samtec

Number of Contacts

160

Product Type

PCB Socket

Sub Type

Board-to-Board

Number of Rows

8

Pitch

1.27mm

Current

2.3A

Housing Material

Liquid Crystal Polymer

Termination Type

Solder

Mount Type

Surface

Orientation

Straight

Connector System

Board-to-Board

Stacking Height

18.5mm

Voltage

240 V

Series

SEAF

Minimum Operating Temperature

-55°C

Row Pitch

2.5mm

Contact Gender

Female

Maximum Operating Temperature

125°C

Contact Plating

Gold

Contact Material

Copper

Standards/Approvals

No

1.27mm SEARAY™ Series Interconnects


SEARAY™ is a 1.27mm high density, high speed board-to-board interconnect system. These SEAM / SEAF Series connectors can be mapped as a single-ended application, differential pair application, or a combination of both. When routed as a single-ended system, SEARAY™ is rated at 12.5 GHz @ -3dB. The SEAM / SEAF Series of High Speed / High Density Open Pin Field Array employs Solder Charge Technology for improved solder joint reliability. These SEAM SEAF Series SEARAY™ High Speed / High Density Open Pin Field Array use the Samtec Edge Rate contact system which gives high speed performance, zippering when mating and unmating as well as lowering insertion and extraction forces.

Various rows high density connectors suitable for board stacking applications

Stack height dependant upon SEAF/SEAM combination from 7 mm

Contact resistance: 5.5 mΩ

Contact Plating: 0.76 μm Gold on contact area with Matte Tin on tail area

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