Amphenol Communications Solutions BergStak Series Straight Surface PCB Socket, 60-Contact, 2 Row, 0.8 mm Pitch Solder
- N° de stock RS:
- 615-9372
- Référence fabricant:
- 61082-061400LF
- Fabricant:
- Amphenol Communications Solutions
Sous-total (1 unité)*
2,92 €
(TVA exclue)
3,53 €
(TVA incluse)
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Unité | Prix par unité |
|---|---|
| 1 + | 2,92 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 615-9372
- Référence fabricant:
- 61082-061400LF
- Fabricant:
- Amphenol Communications Solutions
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Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Amphenol Communications Solutions | |
| Product Type | PCB Socket | |
| Number of Contacts | 60 | |
| Sub Type | Board-to-Board | |
| Number of Rows | 2 | |
| Current | 500mA | |
| Pitch | 0.8mm | |
| Housing Material | Glass Reinforced Liquid Crystal Polymer | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Straight | |
| Connector System | Board-to-Board | |
| Stacking Height | 20mm | |
| Voltage | 100 V | |
| Series | BergStak | |
| Minimum Operating Temperature | -65°C | |
| Contact Material | Beryllium Copper Alloy | |
| Contact Plating | Gold | |
| Maximum Operating Temperature | 125°C | |
| Contact Gender | Female | |
| Standards/Approvals | No | |
| Sélectionner tout | ||
|---|---|---|
Marque Amphenol Communications Solutions | ||
Product Type PCB Socket | ||
Number of Contacts 60 | ||
Sub Type Board-to-Board | ||
Number of Rows 2 | ||
Current 500mA | ||
Pitch 0.8mm | ||
Housing Material Glass Reinforced Liquid Crystal Polymer | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Straight | ||
Connector System Board-to-Board | ||
Stacking Height 20mm | ||
Voltage 100 V | ||
Series BergStak | ||
Minimum Operating Temperature -65°C | ||
Contact Material Beryllium Copper Alloy | ||
Contact Plating Gold | ||
Maximum Operating Temperature 125°C | ||
Contact Gender Female | ||
Standards/Approvals No | ||
0.8mm Bergstak® Series
These FCI Bergstk® high density 0.8mm pitch SMT connectors provide space saving in board to board stacking applications.
Blade-on-beam contacts allow ’peeling’ and prevent ’stubbing’
The Bergstak® system from FCI are high density parallel board to board connectors which can be configured to various PCB stack heights. These Bergstak® connectors are polarized, have generous lead-in angles with precise contact positioning ensuring precise mating alignment and reliability.
Liens connexes
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