Samtec CLP Series Horizontal Surface PCB Socket, 28-Contact, 2 Row, 1.27 mm Pitch Solder
- N° de stock RS:
- 227-1072
- Référence fabricant:
- CLP-114-02-G-D-BE-P-TR
- Fabricant:
- Samtec
Sous-total (1 bobine de 1625 unités)*
7 161,375 €
(TVA exclue)
8 664,50 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 20 mars 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Unité | Prix par unité | la bobine* |
|---|---|---|
| 1625 + | 4,407 € | 7 161,38 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 227-1072
- Référence fabricant:
- CLP-114-02-G-D-BE-P-TR
- Fabricant:
- Samtec
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Samtec | |
| Product Type | PCB Socket | |
| Number of Contacts | 28 | |
| Sub Type | Dual Wipe Socket | |
| Number of Rows | 2 | |
| Current | 3.4A | |
| Pitch | 1.27mm | |
| Housing Material | Liquid Crystal Polymer | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Horizontal | |
| Connector System | Board-to-Board | |
| Voltage | 395 V | |
| Series | CLP | |
| Row Pitch | 1.27mm | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 125°C | |
| Contact Plating | Gold | |
| Contact Material | Phosphor Bronze | |
| Standards/Approvals | No | |
| Sélectionner tout | ||
|---|---|---|
Marque Samtec | ||
Product Type PCB Socket | ||
Number of Contacts 28 | ||
Sub Type Dual Wipe Socket | ||
Number of Rows 2 | ||
Current 3.4A | ||
Pitch 1.27mm | ||
Housing Material Liquid Crystal Polymer | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Horizontal | ||
Connector System Board-to-Board | ||
Voltage 395 V | ||
Series CLP | ||
Row Pitch 1.27mm | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 125°C | ||
Contact Plating Gold | ||
Contact Material Phosphor Bronze | ||
Standards/Approvals No | ||
The Samtec CLP series 1.27mm low profile dual wipe socket has 14 positions and surface mount lead style. It has 0.000254mm gold in contact area and 0.0000762mm on tail.
Dual row
Bottom entry style
Alignment pins
Polyimide film pick & place pad
Tape and reel packaging
Liens connexes
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Horizontal Surface PCB Socket 2 Row, 1.27 mm Pitch Surface Mount
- Samtec CLP Series Straight Surface PCB Socket 2 Row, 1.27 mm Pitch Solder