Samtec CLP Series Vertical Surface PCB Socket, 20-Contact, 2 Row, 1.27 mm Pitch Solder
- N° de stock RS:
- 227-1063
- Référence fabricant:
- CLP-110-02-G-D-P-TR
- Fabricant:
- Samtec
Sous-total (1 bobine de 1200 unités)*
3 555,60 €
(TVA exclue)
4 302,00 €
(TVA incluse)
Ajouter 1200 unités pour bénéficier d'une livraison gratuite
Temporairement en rupture de stock
- Expédition à partir du 19 mars 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Unité | Prix par unité | la bobine* |
|---|---|---|
| 1200 + | 2,963 € | 3 555,60 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 227-1063
- Référence fabricant:
- CLP-110-02-G-D-P-TR
- Fabricant:
- Samtec
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Samtec | |
| Product Type | PCB Socket | |
| Number of Contacts | 20 | |
| Number of Rows | 2 | |
| Sub Type | Micro Socket | |
| Pitch | 1.27mm | |
| Current | 3.4A | |
| Housing Material | Liquid Crystal Polymer | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Vertical | |
| Connector System | Board-to-Board | |
| Voltage | 395 V | |
| Series | CLP | |
| Row Pitch | 1.27mm | |
| Minimum Operating Temperature | -55°C | |
| Contact Material | Phosphor Bronze | |
| Maximum Operating Temperature | 125°C | |
| Contact Plating | Gold | |
| Standards/Approvals | No | |
| Sélectionner tout | ||
|---|---|---|
Marque Samtec | ||
Product Type PCB Socket | ||
Number of Contacts 20 | ||
Number of Rows 2 | ||
Sub Type Micro Socket | ||
Pitch 1.27mm | ||
Current 3.4A | ||
Housing Material Liquid Crystal Polymer | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Vertical | ||
Connector System Board-to-Board | ||
Voltage 395 V | ||
Series CLP | ||
Row Pitch 1.27mm | ||
Minimum Operating Temperature -55°C | ||
Contact Material Phosphor Bronze | ||
Maximum Operating Temperature 125°C | ||
Contact Plating Gold | ||
Standards/Approvals No | ||
The Samtec CLP series 1.27mm low profile dual wipe socket has 10 positions and surface mount lead style. It has 0.000254mm gold in contact area and 0.0000762mm on tail.
Dual row
Pick & place pad
Tape and reel packaging
Liens connexes
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- Samtec CLP Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder