Samtec CLP Series Vertical Surface PCB Socket, 16-Contact, 2 Row, 1.27 mm Pitch Solder
- N° de stock RS:
- 227-1050
- Référence fabricant:
- CLP-108-02-F-D-K-TR
- Fabricant:
- Samtec
Sous-total (1 bobine de 1200 unités)*
2 212,80 €
(TVA exclue)
2 677,20 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 25 mai 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Unité | Prix par unité | la bobine* |
|---|---|---|
| 1200 + | 1,844 € | 2 212,80 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 227-1050
- Référence fabricant:
- CLP-108-02-F-D-K-TR
- Fabricant:
- Samtec
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Samtec | |
| Product Type | PCB Socket | |
| Number of Contacts | 16 | |
| Number of Rows | 2 | |
| Sub Type | Dual Wipe Socket | |
| Current | 3.4A | |
| Pitch | 1.27mm | |
| Housing Material | Liquid Crystal Polymer | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Vertical | |
| Connector System | Board-to-Board | |
| Voltage | 395 V | |
| Series | CLP | |
| Row Pitch | 1.27mm | |
| Minimum Operating Temperature | -55°C | |
| Contact Plating | Gold | |
| Maximum Operating Temperature | 125°C | |
| Contact Material | Phosphor Bronze | |
| Standards/Approvals | No | |
| Sélectionner tout | ||
|---|---|---|
Marque Samtec | ||
Product Type PCB Socket | ||
Number of Contacts 16 | ||
Number of Rows 2 | ||
Sub Type Dual Wipe Socket | ||
Current 3.4A | ||
Pitch 1.27mm | ||
Housing Material Liquid Crystal Polymer | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Vertical | ||
Connector System Board-to-Board | ||
Voltage 395 V | ||
Series CLP | ||
Row Pitch 1.27mm | ||
Minimum Operating Temperature -55°C | ||
Contact Plating Gold | ||
Maximum Operating Temperature 125°C | ||
Contact Material Phosphor Bronze | ||
Standards/Approvals No | ||
The Samtec CLP series 1.27mm low profile dual wipe socket has 8 positions and surface mount lead style. It has 0.0000762mm flash selective gold in contact area and matte tin on tail.
Dual row
Bottom entry style
Tape and reel packaging
Liens connexes
- Samtec CLP Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
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- Samtec CLP Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Straight Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Vertical Surface Mount PCB Socket 2 Row, 1.27 mm Pitch Press-in
- Samtec CLP Series Straight Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec CLP Series Straight Surface PCB Socket 2 Row, 1.27 mm Pitch Solder