Samtec ERF8 Series Vertical Surface PCB Socket, 70-Contact, 2 Row, 1.27 mm Pitch Solder
- N° de stock RS:
- 224-7969
- Référence fabricant:
- ERF8-035-05.0-L-DV-K-TR
- Fabricant:
- Samtec
Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau disponible. RS a l'intention de le retirer de son assortiment sous peu.
- N° de stock RS:
- 224-7969
- Référence fabricant:
- ERF8-035-05.0-L-DV-K-TR
- Fabricant:
- Samtec
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Samtec | |
| Number of Contacts | 70 | |
| Product Type | PCB Socket | |
| Sub Type | Board-to-Board | |
| Number of Rows | 2 | |
| Pitch | 1.27mm | |
| Current | 2.2A | |
| Housing Material | Liquid Crystal Polymer | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Vertical | |
| Connector System | Board-to-Board | |
| Stacking Height | 18mm | |
| Voltage | 318V | |
| Series | ERF8 | |
| Row Pitch | 4.5mm | |
| Minimum Operating Temperature | -55°C | |
| Contact Material | Beryllium Copper Alloy | |
| Contact Plating | Gold | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | No | |
| Sélectionner tout | ||
|---|---|---|
Marque Samtec | ||
Number of Contacts 70 | ||
Product Type PCB Socket | ||
Sub Type Board-to-Board | ||
Number of Rows 2 | ||
Pitch 1.27mm | ||
Current 2.2A | ||
Housing Material Liquid Crystal Polymer | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Vertical | ||
Connector System Board-to-Board | ||
Stacking Height 18mm | ||
Voltage 318V | ||
Series ERF8 | ||
Row Pitch 4.5mm | ||
Minimum Operating Temperature -55°C | ||
Contact Material Beryllium Copper Alloy | ||
Contact Plating Gold | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals No | ||
The Samtec ERF8-S is 0.80 mm edge rate rugged high speed socket and a shielded board-mount socket designed for use in high-speed systems. The ERF8-S uses the edge rate and 60 number of position contact system which is designed for applications requiring high-mating cycles and 56Gbps PAM4 performance. The ERF8-S mates with ERM8-S board-mounted headers.
360º metal shielding for reduced EMI
Available with extended guide post
56 Gbps PAM4 performance
Rugged Edge Rate contacts optimized for signal integrity performance
1.5 mm contact wipe
Positions: 20 - 60
Stack Height: 7, 9, 12 and 16 mm
Liens connexes
- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder