Samtec ERF8 Series Vertical Surface PCB Socket, 70-Contact, 2 Row, 1.27 mm Pitch Solder
- N° de stock RS:
- 224-7969
- Référence fabricant:
- ERF8-035-05.0-L-DV-K-TR
- Fabricant:
- Samtec
Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau disponible. RS a l'intention de le retirer de son assortiment sous peu.
- N° de stock RS:
- 224-7969
- Référence fabricant:
- ERF8-035-05.0-L-DV-K-TR
- Fabricant:
- Samtec
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Samtec | |
| Product Type | PCB Socket | |
| Number of Contacts | 70 | |
| Number of Rows | 2 | |
| Sub Type | Board-to-Board | |
| Current | 2.2A | |
| Pitch | 1.27mm | |
| Termination Type | Solder | |
| Housing Material | Liquid Crystal Polymer | |
| Mount Type | Surface | |
| Orientation | Vertical | |
| Connector System | Board-to-Board | |
| Stacking Height | 18mm | |
| Series | ERF8 | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 4.5mm | |
| Contact Material | Beryllium Copper Alloy | |
| Contact Plating | Gold | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | No | |
| Sélectionner tout | ||
|---|---|---|
Marque Samtec | ||
Product Type PCB Socket | ||
Number of Contacts 70 | ||
Number of Rows 2 | ||
Sub Type Board-to-Board | ||
Current 2.2A | ||
Pitch 1.27mm | ||
Termination Type Solder | ||
Housing Material Liquid Crystal Polymer | ||
Mount Type Surface | ||
Orientation Vertical | ||
Connector System Board-to-Board | ||
Stacking Height 18mm | ||
Series ERF8 | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 4.5mm | ||
Contact Material Beryllium Copper Alloy | ||
Contact Plating Gold | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals No | ||
The Samtec ERF8-S is 0.80 mm edge rate rugged high speed socket and a shielded board-mount socket designed for use in high-speed systems. The ERF8-S uses the edge rate and 60 number of position contact system which is designed for applications requiring high-mating cycles and 56Gbps PAM4 performance. The ERF8-S mates with ERM8-S board-mounted headers.
360º metal shielding for reduced EMI
Available with extended guide post
56 Gbps PAM4 performance
Rugged Edge Rate contacts optimized for signal integrity performance
1.5 mm contact wipe
Positions: 20 - 60
Stack Height: 7, 9, 12 and 16 mm
Liens connexes
- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder
- Samtec ERF8 Series Vertical Surface PCB Socket 2 Row, 1.27 mm Pitch Solder