Samtec ERF8 Series Vertical Surface PCB Socket, 10-Contact, 2 Row, 1.27 mm Pitch Solder

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Offre groupée disponible

Sous-total (1 bobine de 400 unités)*

1 206,40 €

(TVA exclue)

1 459,60 €

(TVA incluse)

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Unité
Prix par unité
la bobine*
400 - 16003,016 €1 206,40 €
2000 +2,811 €1 124,40 €

*Prix donné à titre indicatif

N° de stock RS:
224-7953
Référence fabricant:
ERF8-005-07.0-L-DV-K-TR
Fabricant:
Samtec
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Marque

Samtec

Product Type

PCB Socket

Number of Contacts

10

Number of Rows

2

Sub Type

Board-to-Board

Pitch

1.27mm

Current

2.2A

Termination Type

Solder

Housing Material

Liquid Crystal Polymer

Mount Type

Surface

Orientation

Vertical

Stacking Height

18mm

Connector System

Board-to-Board

Voltage

318 V

Series

ERF8

Row Pitch

4.5mm

Minimum Operating Temperature

-55°C

Contact Material

Beryllium Copper Alloy

Contact Plating

Gold

Maximum Operating Temperature

125°C

Standards/Approvals

No

The Samtec ERF8-S is 0.80 mm edge rate rugged high speed socket and a shielded board-mount socket designed for use in high-speed systems. The ERF8-S uses the edge rate and 10 number of position contact system which is designed for applications requiring high-mating cycles and 56Gbps PAM4 performance. The ERF8-S mates with ERM8-S board-mounted headers.

360º metal shielding for reduced EMI

Available with extended guide post

56 Gbps PAM4 performance

Rugged Edge Rate contacts optimized for signal integrity performance

1.5 mm contact wipe

Positions: 20 - 60

Stack Height: 7, 9, 12 and 16 mm

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