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Sélectionner tout	Attribut	Valeur
	Marque	Amphenol Communications Solutions
	Product Type	PCB Socket
	Number of Contacts	80
	Sub Type	Header
	Number of Rows	2
	Current	800mA
	Pitch	0.8mm
	Termination Type	Solder
	Housing Material	Glass Filled Liquid Crystal Polymer
	Mount Type	Surface
	Orientation	Straight
	Connector System	Board-to-Board
	Stacking Height	20mm
	Voltage	100 V
	Series	BergStak
	Row Pitch	4.4mm
	Minimum Operating Temperature	-40°C
	Maximum Operating Temperature	125°C
	Contact Gender	Male
	Contact Material	Brass
	Contact Plating	Gold
	Standards/Approvals	No

	Sélectionner tout
	Marque Amphenol Communications Solutions
	Product Type PCB Socket
	Number of Contacts 80
	Sub Type Header
	Number of Rows 2
	Current 800mA
	Pitch 0.8mm
	Termination Type Solder
	Housing Material Glass Filled Liquid Crystal Polymer
	Mount Type Surface
	Orientation Straight
	Connector System Board-to-Board
	Stacking Height 20mm
	Voltage 100 V
	Series BergStak
	Row Pitch 4.4mm
	Minimum Operating Temperature -40°C
	Maximum Operating Temperature 125°C
	Contact Gender Male
	Contact Material Brass
	Contact Plating Gold
	Standards/Approvals No

Housing and terminal profile guarantees support of up to 12Gb/s

Vertical versus vertical mating configuration

40 to 200 position sizes in 20 position increments

5 mm to 20 mm stack heights in 1 mm increments

Housing and terminal profile guarantees support of up to 12Gb/s

Vertical versus vertical mating configuration

40 to 200 position sizes in 20 position increments

5 mm to 20 mm stack heights in 1 mm increments

0.8 mm double-row contact pitch conserves printed circuit board space

Scoop-proof feature housings

Multiple plating options available

Multiple packaging options available

PCB locator pegs option

Lead-free

Compatible with PCIe Gen 2/3 and SAS 3.0 high speed performance on selected stack heights

Suitable for parallel board stacking applications

Comprehensive range of sizes and stack heights to satisfy all needs

High density for all electrical applications needs

Prevents reverse mating

Satisfies different application requirement

Suitable for varies feeding processing

Facilitates ease and accuracy during manual assembly

BergStak® 0.80 mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 80 Positions.

Amphenol Communications Solutions BergStak Series Straight Surface PCB Socket, 80-Contact, 2 Row, 0.8 mm Pitch Solder

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