Amphenol ICC 61083 Series Vertical Through Hole PCB Header, 40-Contact, 2 Row, 0.8 mm Pitch Through Hole
- N° de stock RS:
- 797-512
- Référence fabricant:
- 61083-043402LF
- Fabricant:
- Amphenol ICC
Sous-total (1 bobine de 700 unités)*
1 460,65 €
(TVA exclue)
1 767,39 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Stocké-e par le fabricant
- Prêt à être expédié à partir du 17 décembre 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Bobine(s) | la bobine | Prix par unité* |
|---|---|---|
| 1 + | 1 460,65 € | 2,087 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 797-512
- Référence fabricant:
- 61083-043402LF
- Fabricant:
- Amphenol ICC
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Amphenol ICC | |
| Number of Contacts | 40 | |
| Product Type | PCB Header | |
| Sub Type | Connector | |
| Number of Rows | 2 | |
| Pitch | 0.8mm | |
| Current | 0.8A | |
| Housing Material | Glass Filled LCP | |
| Termination Type | Through Hole | |
| Mount Type | Through Hole | |
| Orientation | Vertical | |
| Voltage | 100V | |
| Series | 61083 | |
| Minimum Operating Temperature | -40°C | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 125°C | |
| Contact Plating | Gold | |
| Sélectionner tout | ||
|---|---|---|
Marque Amphenol ICC | ||
Number of Contacts 40 | ||
Product Type PCB Header | ||
Sub Type Connector | ||
Number of Rows 2 | ||
Pitch 0.8mm | ||
Current 0.8A | ||
Housing Material Glass Filled LCP | ||
Termination Type Through Hole | ||
Mount Type Through Hole | ||
Orientation Vertical | ||
Voltage 100V | ||
Series 61083 | ||
Minimum Operating Temperature -40°C | ||
Contact Gender Male | ||
Maximum Operating Temperature 125°C | ||
Contact Plating Gold | ||
- Pays d'origine :
- CN
The Amphenol ICC Mezzanine connector is designed for high-speed, high-density applications, offering an effective board-to-board interconnection solution. It features various configurations, making it suitable for an array of industrial applications.
Supports up to 12Gb/s performance on selected stack heights
Offers a comprehensive range of sizes and stack heights
Temperature range from -40°C to +125°C
Meets RoHS compliance and is lead-free
Durability of 100 mating cycles ensures reliable performance
Multiple packaging options facilitate various assembly processes
Compatible with PCIe Gen 2/3 and SAS 3.0 standards
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