TE Connectivity AMPMODU Series Horizontal Board Receptacle, 20-Contact, 2 Row, 2 mm Pitch Through Hole
- N° de stock RS:
- 788-021
- Référence fabricant:
- 2-2314924-0
- Fabricant:
- TE Connectivity
Sous-total (1 bobine de 400 unités)*
1 518,01 €
(TVA exclue)
1 836,79 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Nouveau produit - précommandez dès aujourd'hui
- Expédition à partir du 09 novembre 2026
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Bobine(s) | la bobine | Prix par unité* |
|---|---|---|
| 1 + | 1 518,01 € | 3,795 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 788-021
- Référence fabricant:
- 2-2314924-0
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Number of Contacts | 20 | |
| Product Type | Receptacle | |
| Sub Type | Receptacle | |
| Number of Rows | 2 | |
| Current | 2A | |
| Pitch | 2mm | |
| Housing Material | Liquid Crystal Polymer | |
| Termination Type | Through Hole | |
| Mount Type | Board | |
| Orientation | Horizontal | |
| Connector System | Board-to-Board | |
| Voltage | 125V | |
| Series | AMPMODU | |
| Minimum Operating Temperature | -40°C | |
| Contact Plating | Tin | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | RoHS | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Number of Contacts 20 | ||
Product Type Receptacle | ||
Sub Type Receptacle | ||
Number of Rows 2 | ||
Current 2A | ||
Pitch 2mm | ||
Housing Material Liquid Crystal Polymer | ||
Termination Type Through Hole | ||
Mount Type Board | ||
Orientation Horizontal | ||
Connector System Board-to-Board | ||
Voltage 125V | ||
Series AMPMODU | ||
Minimum Operating Temperature -40°C | ||
Contact Plating Tin | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals RoHS | ||
- Pays d'origine :
- CN
The TE Connectivity Connector is a High quality solution designed for reliable board-to-board applications. It features a Compact 2 mm design that enhances signal integrity in constrained spaces, making it suitable for various electronic devices.
Utilises a dual-beam contact design for superior signal reliability
Supports multiple mounting options, including surface mount and through-hole
Capable of handling reflow solder processes up to 260°C
Available in both single and double row configurations for design flexibility
Liens connexes
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