Molex 50555 Series Vertical Board PCB Socket, 40-Contact, 2 Row, 0.4 mm Pitch Surface Mount

Sous-total (1 bobine de 7000 unités)*

5 896,93 €

(TVA exclue)

7 135,29 €

(TVA incluse)

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  • Prêt à être expédié à partir du 07 juillet 2026
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Bobine(s)
la bobine
Prix par unité*
1 +5 896,93 €0,842 €

*Prix donné à titre indicatif

N° de stock RS:
520-708
Numéro d'article Distrelec:
304-56-577
Référence fabricant:
505550-4020
Fabricant:
Molex
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Marque

Molex

Number of Contacts

40

Product Type

PCB Socket

Number of Rows

2

Sub Type

PCB Receptacle

Pitch

0.4mm

Current

0.3A

Termination Type

Surface Mount

Housing Material

Liquid Crystal Polymer

Mount Type

Board

Orientation

Vertical

Stacking Height

0.8mm

Voltage

50Vrms

Series

50555

Minimum Operating Temperature

-40°C

Row Pitch

0.4mm

Contact Plating

Gold

Maximum Operating Temperature

85°C

Contact Material

Copper Alloy

Standards/Approvals

IEC 61249-2-21, EU 2015/863

Pays d'origine :
JP
The Molex Board-to-Board Receptacle represents a sophisticated innovation in interconnect solutions, tailored for applications demanding precision and reliability. With a Compact 0.40mm pitch design, this connector enhances space efficiency without compromising performance. Designed for board-to-board applications, it facilitates seamless connections with its 40-circuit capacity, ensuring robust data integrity and electrical performance. Its black resin finish and surface mount termination style are engineered to withstand operational temperatures from -40° to +85°C, making it suitable for diverse environments. Notably, the product is non-recommended for new designs, yet it remains a testament to Advanced engineering, showcasing premium materials and meticulous attention to durability with a maximum of 30 mating cycles.

Designed to support high-density applications with maximum reliability

Offers a vertical orientation for easy integration into existing systems

Includes a robust packaging type of embossed tape on reel for safe handling

Constructed from high-quality liquid crystal polymer for enhanced thermal resistance

Equipped with a PCB retention feature ensuring stable mounting within devices

Utilises a copper alloy construction with gold plating to minimise contact resistance

Incorporates a lock to mating part mechanism for secure connections

Achieves compliance with multiple environmental standards enhancing its market flexibility

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