Molex 50555 Series Vertical Board Mount PCB Socket, 40-Contact, 2-Row, 0.4mm Pitch, Surface Mount Termination
- N° de stock RS:
- 520-708
- Référence fabricant:
- 505550-4020
- Fabricant:
- Molex
Sous-total (1 bobine de 7000 unités)*
5 665,68 €
(TVA exclue)
6 855,47 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 30 janvier 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Bobine(s) | la bobine | Prix par unité* |
|---|---|---|
| 1 + | 5 665,68 € | 0,809 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 520-708
- Référence fabricant:
- 505550-4020
- Fabricant:
- Molex
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Molex | |
| Number of Contacts | 40 | |
| Number of Rows | 2 | |
| Pitch | 0.4mm | |
| Type | PCB Mount Receptacle | |
| Mounting Type | Board Mount | |
| Body Orientation | Vertical | |
| Termination Method | Surface Mount | |
| Series | 50555 | |
| Sélectionner tout | ||
|---|---|---|
Marque Molex | ||
Number of Contacts 40 | ||
Number of Rows 2 | ||
Pitch 0.4mm | ||
Type PCB Mount Receptacle | ||
Mounting Type Board Mount | ||
Body Orientation Vertical | ||
Termination Method Surface Mount | ||
Series 50555 | ||
- Pays d'origine :
- JP
The TE Connectivity Board-to-Board Receptacle represents a sophisticated innovation in interconnect solutions, tailored for applications demanding precision and reliability. With a compact 0.40mm pitch design, this connector enhances space efficiency without compromising performance. Designed for board-to-board applications, it facilitates seamless connections with its 40-circuit capacity, ensuring robust data integrity and electrical performance. Its black resin finish and surface mount termination style are engineered to withstand operational temperatures from -40° to +85°C, making it suitable for diverse environments. Notably, the product is non-recommended for new designs, yet it remains a testament to advanced engineering, showcasing premium materials and meticulous attention to durability with a maximum of 30 mating cycles.
Designed to support high-density applications with maximum reliability
Offers a vertical orientation for easy integration into existing systems
Includes a robust packaging type of embossed tape on reel for safe handling
Constructed from high-quality liquid crystal polymer for enhanced thermal resistance
Equipped with a PCB retention feature ensuring stable mounting within devices
Utilises a copper alloy construction with gold plating to minimise contact resistance
Incorporates a lock to mating part mechanism for secure connections
Achieves compliance with multiple environmental standards enhancing its market flexibility
Offers a vertical orientation for easy integration into existing systems
Includes a robust packaging type of embossed tape on reel for safe handling
Constructed from high-quality liquid crystal polymer for enhanced thermal resistance
Equipped with a PCB retention feature ensuring stable mounting within devices
Utilises a copper alloy construction with gold plating to minimise contact resistance
Incorporates a lock to mating part mechanism for secure connections
Achieves compliance with multiple environmental standards enhancing its market flexibility
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