Molex 87758 Series Vertical Through Hole PCB Socket, 12-Contact, 2 Row, 2 mm Pitch Solder Pin

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Sous-total (1 paquet de 100 unités)*

188,84 €

(TVA exclue)

228,50 €

(TVA incluse)

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  • Expédition à partir du 24 mars 2026
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le paquet
Prix par unité*
1 +188,84 €1,888 €

*Prix donné à titre indicatif

N° de stock RS:
507-414
Numéro d'article Distrelec:
304-62-754
Référence fabricant:
87758-1216
Fabricant:
Molex
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Marque

Molex

Product Type

PCB Socket

Number of Contacts

12

Number of Rows

2

Sub Type

Header

Pitch

2mm

Current

2A

Termination Type

Solder Pin

Housing Material

Nylon

Mount Type

Through Hole

Orientation

Vertical

Connector System

Signal, Board-to-Board

Voltage

125 V

Series

87758

Row Pitch

2mm

Minimum Operating Temperature

-55°C

Contact Plating

Gold

Contact Material

Phosphor Bronze

Maximum Operating Temperature

105°C

Standards/Approvals

No

Pays d'origine :
ID
The TE Connectivity Milli-Grid Header is engineered for superior performance in PCB applications, bringing together reliability and precision in a compact design. Its 2.00mm pitch delivers optimal connectivity, accommodating 12 circuits while ensuring a secure, vertical fit through hole configuration. Constructed with durable materials, this header features selective gold plating for enhanced conductivity and corrosion resistance. Adhering to strict compliance standards, it is an ideal choice for industries prioritizing both environmental sustainability and robust performance in board-to-board signal applications. Emphasizing ease of use, the product is conveniently packaged in a pocket tray, streamlining installation and contributing to an efficient workflow. Designed to withstand harsh operational conditions, it functions flawlessly within an extended temperature range, making it a versatile addition to any project requiring durable interconnection solutions.

Employs advanced selective plating for better conductivity

Accommodates a robust 12 circuits for versatile applications

Utilizes temperature-resistant materials suitable for extreme environments

Packaged conveniently to enhance installation efficiency

Designed for both lead-free and traditional solder processes

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