TE Connectivity 53328 Series Vertical Board PCB Socket, 150-Contact, 3 Row, 2.54 mm Pitch Solder

Voir l’ensemble des PCB Sockets

Sous-total (1 unité)*

371,45 €

(TVA exclue)

449,45 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 03 mars 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Unité
Prix par unité
1 +371,45 €

*Prix donné à titre indicatif

N° de stock RS:
481-081
Numéro d'article Distrelec:
303-30-750
Référence fabricant:
533287-7
Fabricant:
TE Connectivity
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

TE Connectivity

Product Type

PCB Socket

Number of Contacts

150

Sub Type

PCB Receptacle

Number of Rows

3

Pitch

2.54mm

Current

3A

Termination Type

Solder

Housing Material

Thermoplastic

Mount Type

Board

Orientation

Vertical

Connector System

Board-to-Board

Stacking Height

15.24mm

Series

53328

Row Pitch

2.54mm

Minimum Operating Temperature

65°C

Maximum Operating Temperature

125°C

Contact Gender

Female

Contact Plating

Gold

Contact Material

Beryllium Copper Alloy

Standards/Approvals

UL 94 V-0

Non conforme

Pays d'origine :
US
The TE Connectivity PCB Mount Receptacle is engineered for seamless vertical integration in board-to-board applications, supporting 150 positions with precision-focused 2.54 mm centreline spacing. Crafted for reliability, this connector delivers robust signal integrity while utilising gold plating to enhance conductivity and protect against wear. The through-hole solder termination ensures secure mounting to printed circuit boards, making it a dependable choice for engineers seeking durability. Designed with a brown thermoplastic housing, this component promises both aesthetic appeal and high performance under varying environmental conditions, with an operating temperature range from -65 to 125 °C. This connector is not merely a component; it exemplifies the perfect blend of functionality and design in modern electronic assemblies.

Designed specifically for board-to-board connections to streamline your assembly process

Constructed with a four-beam contact shape to ensure optimal performance in signal transmission

Features a polarized mating alignment for effortless connectivity, reducing the risk of misalignment

Utilizes beryllium copper for contact base material, providing excellent conductivity and resilience

Incorporates a stackable design, perfect for applications where space is at a premium

Liens connexes