TE Connectivity Champ Series Vertical Board PCB Header, 160-Contact, 1.27 mm Pitch Solder

Voir l’ensemble des PCB Sockets

Sous-total (1 bobine de 32 unités)*

259,16 €

(TVA exclue)

313,58 €

(TVA incluse)

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  • Expédition à partir du 06 avril 2026
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la bobine
Prix par unité*
1 +259,16 €8,099 €

*Prix donné à titre indicatif

N° de stock RS:
480-063
Numéro d'article Distrelec:
304-53-387
Référence fabricant:
1-1734101-4
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Number of Contacts

160

Product Type

PCB Header

Sub Type

PCB Receptacle

Pitch

1.27mm

Current

1A

Housing Material

Matt

Termination Type

Solder

Mount Type

Board

Orientation

Vertical

Connector System

Board-to-Board

Voltage

250 V

Series

Champ

Row Pitch

1.27mm

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

85°C

Contact Gender

Female

Contact Plating

Gold Flash

Contact Material

Phosphor Bronze

Standards/Approvals

UL 94 V-0

Pays d'origine :
CN
The TE Connectivity PCB Mount Receptacle from TE Connectivity is engineered to ensure robust performance in board-to-board connectivity applications. Featuring a vertical orientation and a high-density configuration of 160 positions, this component is ideal for compact electronic designs where space is a premium. With a centerline pitch of 1.27 mm, it maximizes space efficiency while maintaining reliability in electrical connections. Its construction with gold flash plating enhances durability and conductivity, making it suitable for a variety of environments. Designed specifically for through-hole solder termination, this receptacle provides dependable mechanical and electrical stability, ensuring a secure connection throughout its operating life. Its extensive operating temperature range of -55 to 85 °C indicates the versatility and resilience of this product, making it an excellent choice for diverse applications in electronics.

Utilizes a standard connector profile for easy integration

PCB mount orientation facilitates straightforward assembly

Designed for board-to-board connectivity to enhance design flexibility

Incorporates polarized mating alignment features for simplified connection

Constructed with phosphor bronze for superior contact reliability

Matte housing material enhances visual aesthetics while ensuring performance

Compatible with wave solder processes for efficient manufacturing

Utilizes a PCB retention feature to provide secure attachment

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