TE Connectivity AMPMODU Series Vertical Board PCB Header, 80-Contact, 2 Row, 1.27 mm Pitch Solder

Voir l’ensemble des PCB Sockets

Sous-total (1 tube de 10 unités)*

192,43 €

(TVA exclue)

232,84 €

(TVA incluse)

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  • Expédition à partir du 25 février 2026
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Tube(s)
le tube
Prix par unité*
1 +192,43 €19,243 €

*Prix donné à titre indicatif

N° de stock RS:
478-974
Numéro d'article Distrelec:
304-48-506
Référence fabricant:
104078-7
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Number of Contacts

80

Product Type

PCB Header

Sub Type

PCB Receptacle

Number of Rows

2

Pitch

1.27mm

Current

4A

Housing Material

Thermoplastic

Termination Type

Solder

Mount Type

Board

Orientation

Vertical

Connector System

Board-to-Board

Voltage

30 V

Series

AMPMODU

Minimum Operating Temperature

65°C

Row Pitch

1.27mm

Contact Material

Copper Alloy

Contact Plating

Gold

Maximum Operating Temperature

105°C

Contact Gender

Female

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Pays d'origine :
MX
The TE Connectivity PCB mount receptacle is designed for vertical board-to-board connections, featuring an 80-position layout with a precise 1.27 mm centreline. Built for durability and reliability, it utilises high-quality gold plating to ensure optimal signal transmission and robust contact performance. With a thermoplastic housing material, this connector thrives in demanding environments, capable of withstanding temperatures from -65 to 105 °C. Its through-hole solder termination method ensures a secure and stable connection to printed circuit boards, simplifying the assembly process and enhancing product endurance. The device's thoughtful engineering addresses common electrical characteristics such as insulation resistance and current rating, enabling it to meet stringent industry standards.

PCB connector type optimised for vertical mounting in dense layouts

Designed specifically for board to board applications enhancing connectivity options

Robust construction ensures long lasting performance in challenging conditions

Features a dual row configuration for increased connection density

High insulation resistance helps maintain reliable performance over time

Suitable for applications operating at up to 30 VAC accommodating various circuit needs

Gold contact plating ensures superior conductive properties for signal integrity

Reduces assembly complexity with its easy to manage through hole soldering method

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