TE Connectivity 51779 Series Vertical Board PCB Socket, 120-Contact, 0.8 mm Pitch Surface Mount

Sous-total (1 bobine de 700 unités)*

3 472,38 €

(TVA exclue)

4 201,58 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 17 février 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Bobine(s)
la bobine
Prix par unité*
1 +3 472,38 €4,961 €

*Prix donné à titre indicatif

N° de stock RS:
478-799
Numéro d'article Distrelec:
304-52-041
Référence fabricant:
5177985-5
Fabricant:
TE Connectivity
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

TE Connectivity

Product Type

PCB Socket

Number of Contacts

120

Sub Type

PCB Receptacle

Current

0.5A

Pitch

0.8mm

Termination Type

Surface Mount

Housing Material

Matt

Mount Type

Board

Orientation

Vertical

Connector System

Board-to-Board

Stacking Height

8mm

Voltage

100 V

Series

51779

Minimum Operating Temperature

-40°C

Row Pitch

0.8mm

Maximum Operating Temperature

125°C

Contact Plating

Gold

Contact Material

Copper Alloy

Contact Gender

Female

Standards/Approvals

UL 94V-0, 2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant

Pays d'origine :
CN
The TE Connectivity PCB Mount Receptacle is expertly engineered for seamless board-to-board connections, embodying cutting-edge design with a vertical orientation. This connector features 120 positions along a .8 mm centreline, making it ideal for applications requiring reliable signal integrity in constrained spaces. Designed with precision, it incorporates high-quality materials including gold plating to enhance conductivity and minimise wear over time. The receptacle supports a wide operating temperature range and is built to withstand high voltage, ensuring durability and performance in critical environments. Suitable for various applications, it assures robust connections in parallel stacking configurations, meeting the evolving needs of modern electronic assemblies.

Supports a wide operating temperature range for versatile applications

Facilitates parallel stacking for space-efficient designs

Integrated with positioning bosses for secure mounting

Low halogen content ensures compliance with environmental standards

Reflow solder capable for efficient assembly processes

Liens connexes