Molex 50315 Series Vertical Board PCB Socket, 11-Contact, 1 Row, 1.5 mm Pitch Solder

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Sous-total (1 plateau de 400 unités)*

204,82 €

(TVA exclue)

247,83 €

(TVA incluse)

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  • Expédition à partir du 02 mars 2026
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1 +204,82 €0,512 €

*Prix donné à titre indicatif

N° de stock RS:
478-717
Numéro d'article Distrelec:
304-62-329
Référence fabricant:
503159-1100
Fabricant:
Molex
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Marque

Molex

Number of Contacts

11

Product Type

PCB Socket

Number of Rows

1

Sub Type

PCB Receptacle

Current

2A

Pitch

1.5mm

Termination Type

Solder

Mount Type

Board

Orientation

Vertical

Voltage

100 V

Series

50315

Minimum Operating Temperature

-40°C

Row Pitch

1.5mm

Contact Material

Copper Alloy

Contact Plating

Tin

Maximum Operating Temperature

105°C

Standards/Approvals

RoHS

Pays d'origine :
JP
The TE Connectivity 1.50mm Pitch PCB Receptacle is designed to seamlessly integrate into your electronic assemblies, providing robust connectivity in a compact form factor. Featuring a single-row design with 11 circuits, it ensures efficient signal and power transmission in a variety of applications, including wire-to-board connections. The vertical orientation and through-hole termination style enhance its usability in high-density circuit boards. Its durable construction incorporates tin plating over copper alloy, ensuring reliable performance even in demanding environments. With a temperature range of -40° to +105°C, this component is engineered to excel across various operational conditions, making it an ideal choice for modern electronic solutions.

Designed for efficient wire-to-board applications

Single row configuration optimises space utilisation on PCBs

Vertical orientation facilitates installation in compact devices

Positive lock mechanism ensures secure mating with compatible plugs

Constructed with materials that enhance durability and longevity

Meets industry compliance standards for reliable performance

Ideal for use in a wide range of temperature environments

Compatible with multiple part plugs for flexible connectivity

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