Molex 50541 Series Vertical Board PCB Socket, 40-Contact, 2 Row, 0.35 mm Pitch Surface Mount

Voir l’ensemble des PCB Sockets

Sous-total (1 bobine de 7000 unités)*

5 203,18 €

(TVA exclue)

6 295,85 €

(TVA incluse)

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  • Expédition à partir du 27 février 2026
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la bobine
Prix par unité*
1 +5 203,18 €0,743 €

*Prix donné à titre indicatif

N° de stock RS:
478-635
Numéro d'article Distrelec:
304-62-467
Référence fabricant:
505413-4010
Fabricant:
Molex
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Marque

Molex

Product Type

PCB Socket

Number of Contacts

40

Sub Type

PCB Receptacle

Number of Rows

2

Pitch

0.35mm

Current

0.3A

Termination Type

Surface Mount

Housing Material

Liquid Crystal Polymer

Mount Type

Board

Orientation

Vertical

Stacking Height

1mm

Voltage

5 V

Series

50541

Minimum Operating Temperature

-40°C

Row Pitch

0.35mm

Maximum Operating Temperature

85°C

Contact Material

Copper Alloy

Contact Plating

Gold

Standards/Approvals

IPC 1752A Class D, IPC 1752A Class C, IEC-62474, IEC 61249-2-21, EU 2015/863, D (2024) 7663-DC, chemSHERPA

Pays d'origine :
JP
The TE Connectivity slim stack board-to-board receptacle redefines connection standards by offering unparalleled performance in compact form factors. Designed for precision, it accommodates a pitch of 0.35mm while ensuring robust engagement even in challenging environments. The receptacle supports heights from 0.90mm to 1.00mm and enables seamless integration with a maximum of 40 circuits. Crafted for reliability, the component utilises top-tier materials, including a copper alloy and liquid crystal polymer construction. With an active status and compliance to various international standards, this receptacle is the go-to choice for modern electronic applications where space-saving and efficiency are paramount.

Optimised for a compact footprint, ensuring maximum efficiency in design

Serves to enhance board flexibility, integrating effortlessly with compatible plugs

Built to withstand a substantial number of mating cycles for long-lasting performance

Ensures superior electrical connectivity while minimising potential signal interference

Constructed from low-halogen materials for a more environmentally-friendly profile

Offers a vertical orientation for easy assembly and space optimisation on PCBs

Features an embossed tape on reel packaging for efficient handling and storage

Withstands extreme temperatures, helping maintain performance across varied conditions

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