Molex 54722 Series Vertical Board PCB Socket, 50-Contact, 2 Row, 0.5 mm Pitch Surface Mount

Sous-total (1 bobine de 3000 unités)*

2 279,48 €

(TVA exclue)

2 758,17 €

(TVA incluse)

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  • Expédition à partir du 16 mars 2026
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la bobine
Prix par unité*
1 +2 279,48 €0,76 €

*Prix donné à titre indicatif

N° de stock RS:
478-326
Numéro d'article Distrelec:
304-57-481
Référence fabricant:
54722-0504
Fabricant:
Molex
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Marque

Molex

Number of Contacts

50

Product Type

PCB Socket

Number of Rows

2

Sub Type

PCB Receptacle

Current

0.5A

Pitch

0.5mm

Termination Type

Surface Mount

Housing Material

High Temperature Thermoplastic

Mount Type

Board

Orientation

Vertical

Stacking Height

1.5mm

Voltage

5 V

Series

54722

Minimum Operating Temperature

-40°C

Row Pitch

0.5mm

Contact Plating

Gold

Maximum Operating Temperature

105°C

Contact Material

Phosphor Bronze

Standards/Approvals

IEC 61249-2-21, UL E29179

Pays d'origine :
CN
The TE Connectivity Receptacle offers a brilliant solution for streamlined board-to-board connections with a 0.50mm pitch. Designed for surface mounting, it boasts a dual-row configuration, facilitating efficient space utilisation within your electronic products. With a stacking height of just 1.50mm, this component is ideal for applications where space is at a premium while maintaining robust performance. The product merges advanced design with superior materials, featuring gold plating combined with nickel barrier plating for enhanced contact reliability. Notably compliant with various international standards, it ensures that your projects meet environmental regulations, making it a trustworthy choice for modern electronics.

Employs a compact design for optimised PCB space management

Integrates gold plating and nickel barrier for improved durability

Supports a maximum operating voltage of 50V to accommodate diverse applications

Configured to handle up to 0.5A current per contact, ensuring reliable power transmission

Durability rated for up to 30 mating cycles, promoting long product life

Features a high-temperature thermoplastic resin construction for enhanced heat resistance

Vertical orientation simplifies assembly and installation in tight spaces

Embossed tape packaging streamlines logistics and storage

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