TE Connectivity 2291 Series Vertical Board Mount PCB Header, 30-Contact, 2-Row, 0.5mm Pitch, Surface Mount Termination
- N° de stock RS:
- 476-376
- Référence fabricant:
- 2291283-2
- Fabricant:
- TE Connectivity
Sous-total (1 bobine de 1000 unités)*
1 569,21 €
(TVA exclue)
1 898,74 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 09 février 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Bobine(s) | la bobine | Prix par unité* |
|---|---|---|
| 1 + | 1 569,21 € | 1,569 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 476-376
- Référence fabricant:
- 2291283-2
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
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Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Number of Contacts | 30 | |
| Number of Rows | 2 | |
| Pitch | 0.5mm | |
| Type | Socket | |
| Mounting Type | Board Mount | |
| Body Orientation | Vertical | |
| Termination Method | Surface Mount | |
| Series | 2291 | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Number of Contacts 30 | ||
Number of Rows 2 | ||
Pitch 0.5mm | ||
Type Socket | ||
Mounting Type Board Mount | ||
Body Orientation Vertical | ||
Termination Method Surface Mount | ||
Series 2291 | ||
- Pays d'origine :
- CN
The TE Connectivity PCB mount hermaphroditic connector is designed for vertical board-to-board applications, providing reliable performance with its 30 positions and 0.5 mm centreline spacing. Constructed for demanding conditions, it features gold-plated contacts for enhanced conductivity and minimised signal loss. The connector readily integrates into circuit boards, ensuring effective signal transmission for a variety of electronic devices. With a robust thermoplastic housing, it withstands a wide operating temperature range, making it ideal for diverse industrial applications. Its thoughtful design promotes ease of assembly, utilising pick-and-place technology for efficient production processes.
Compact design for space efficient layouts
Gold plating enhances contact durability and performance
Vertical orientation simplifies routing and installation
Parallel configuration supports reliable connections
Low halogen materials contribute to environmental safety
Thermoplastic housing ensures long term reliability
Solder peg retention design enhances stability
Regulatory compliance with key industry standards
Gold plating enhances contact durability and performance
Vertical orientation simplifies routing and installation
Parallel configuration supports reliable connections
Low halogen materials contribute to environmental safety
Thermoplastic housing ensures long term reliability
Solder peg retention design enhances stability
Regulatory compliance with key industry standards
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