TE Connectivity 53497 Series Vertical Board PCB Socket, 50-Contact, 2 Row, 2.54 mm Pitch Solder

Sous-total (1 tube de 7 unités)*

245,36 €

(TVA exclue)

296,89 €

(TVA incluse)

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  • Expédition à partir du 03 mars 2026
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Tube(s)
le tube
Prix par unité*
1 +245,36 €35,051 €

*Prix donné à titre indicatif

N° de stock RS:
471-946
Numéro d'article Distrelec:
304-54-273
Référence fabricant:
534972-3
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Number of Contacts

50

Product Type

PCB Socket

Sub Type

PCB Receptacle

Number of Rows

2

Current

3A

Pitch

2.54mm

Termination Type

Solder

Housing Material

Philips Ryton

Mount Type

Board

Orientation

Vertical

Stacking Height

11.43mm

Connector System

Board-to-Board

Voltage

250 V

Series

53497

Minimum Operating Temperature

65°C

Row Pitch

2.54mm

Contact Gender

Female

Contact Plating

Gold

Contact Material

Phosphor Bronze

Maximum Operating Temperature

105°C

Standards/Approvals

UL E28476, CSA LR7189

Non conforme

Pays d'origine :
MX
The TE Connectivity PCB Mount Receptacle is an expertly designed connector, ideal for board-to-board applications. This vertical connector accommodates 50 positions, providing a compact yet robust solution for space-constrained environments. It features a reliable combination of gold and tin-lead plating, ensuring optimal electrical performance and durability. Built with high-quality materials, this receptacle is rated for up to 250 VAC, making it suitable for various demanding applications. Designed with ease of installation in mind, its through-hole solder termination guarantees strong mechanical stability on printed circuit boards. This connector not only meets stringent industry standards but is also compliant with safety regulations, providing peace of mind for engineers and designers alike.

Boasts a comprehensive operating temperature range for versatility

Designed for ease of use with straightforward solder termination

Optimised for high current applications without compromising safety

Supports a parallel board-to-board configuration for effective connectivity

Manufactured from durable materials to withstand environmental stresses

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