TE Connectivity AMPMODU MOD II Series Straight Through Hole Pin Header, 1 Contact(s), 2.54 mm Pitch, 1 Row, Unshrouded

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Offre groupée disponible

Sous-total (1 paquet de 10 unités)*

4,24 €

(TVA exclue)

5,13 €

(TVA incluse)

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  • Expédition à partir du 17 septembre 2026
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Unité
Prix par unité
le paquet*
10 - 1900,424 €4,24 €
200 - 7400,352 €3,52 €
750 - 29900,298 €2,98 €
3000 - 59900,243 €2,43 €
6000 +0,238 €2,38 €

*Prix donné à titre indicatif

Options de conditionnement :
N° de stock RS:
797-2983
Référence fabricant:
87224-1
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

AMPMODU MOD II

Product Type

Pin Header

Current

3A

Pitch

2.54mm

Housing Material

Thermoplastic

Number of Contacts

1

Number of Rows

1

Orientation

Straight

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board, Wire-to-Board

Mount Type

Through Hole

Contact Material

Copper Alloy

Contact Plating

Gold

Row Pitch

2.54mm

Minimum Operating Temperature

-55°C

Termination Type

Solder

Contact Gender

Male

Tail Pin Length

3.18mm

Maximum Operating Temperature

125°C

Mating Pin Length

8.08mm

Standards/Approvals

No

Voltage

750 V

Pays d'origine :
MX

TE Connectivity AMPMODU MOD II 2.54mm Standard Single Row Unshrouded Headers


AMPMODU MOD II standard single row PCB mount unshrouded headers with a 2.54mm centreline and 0.64mm square

straight post. These AMPMODU MOD II standard unshrouded headers have 94V-0 rated black thermoplastic housings and a choice of contact platings:

Part numbers 87220-X have 0.00076 μm gold plating on the contact area

Part numbers 87224-X have 0.00038 μm gold plating on the contact area

2.54mm TE Connectivity AMPMODU Mod II Interconnect System


The AMPMODU Interconnect system is the signal standard for automation and control applications and is both reliable and economical. The AMPMODU Interconnect system consists of board to board, wire to board and wire to wire connectors with a compact design. When combined, these connectors can be used in a wide variety of industrial applications and systems

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