Samtec SEARAY SEAM Series Straight Surface Mount PCB Header, 1.27mm Pitch
- N° de stock RS:
- 767-9054
- Référence fabricant:
- SEAM-50-03.5-S-10-2-A-K-TR
- Fabricant:
- Samtec
Indisponible
RS n'aura plus ce produit en stock.
- N° de stock RS:
- 767-9054
- Référence fabricant:
- SEAM-50-03.5-S-10-2-A-K-TR
- Fabricant:
- Samtec
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Samtec | |
| Series | SEARAY SEAM | |
| Pitch | 1.27mm | |
| Body Orientation | Straight | |
| Mounting Type | Surface Mount | |
| Connector System | Board to Board | |
| Termination Method | Solder | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Sélectionner tout | ||
|---|---|---|
Marque Samtec | ||
Series SEARAY SEAM | ||
Pitch 1.27mm | ||
Body Orientation Straight | ||
Mounting Type Surface Mount | ||
Connector System Board to Board | ||
Termination Method Solder | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
1.27mm SEARAY™ Series Interconnects
SEARAY™ is a 1.27mm high density, high speed board-to-board interconnect system. These SEAM / SEAF Series connectors can be mapped as a single-ended application, differential pair application, or a combination of both. When routed as a single-ended system, SEARAY™ is rated at 12.5 GHz @ -3dB. The SEAM / SEAF Series of High Speed / High Density Open Pin Field Array employs Solder Charge Technology for improved solder joint reliability. These SEAM SEAF Series SEARAY™ High Speed / High Density Open Pin Field Array use the Samtec Edge Rate contact system which gives high speed performance, zippering when mating and unmating as well as lowering insertion and extraction forces.
Various rows high density connectors suitable for board stacking applications
Stack height dependant upon SEAF/SEAM combination from 7 mm
Contact resistance: 5.5 mΩ
Contact Plating: 0.76 μm Gold on contact area with Matte Tin on tail area
Stack height dependant upon SEAF/SEAM combination from 7 mm
Contact resistance: 5.5 mΩ
Contact Plating: 0.76 μm Gold on contact area with Matte Tin on tail area
Liens connexes
- Samtec SEAM Series Horizontal Surface PCB Header 1.27 mm Pitch Shrouded
- Samtec SEAM Series Straight Surface PCB Header 1.27 mm Pitch Shrouded
- Samtec SEAM Series Straight Surface PCB Header 1.27 mm Pitch Shrouded
- Samtec SEAM Series Straight Surface PCB Header 1.27 mm Pitch Shrouded
- Samtec SEAM Series Straight Surface PCB Header 1.27 mm Pitch Shrouded
- Samtec SEAM Series Straight Surface PCB Header 1.27 mm Pitch Shrouded
- Samtec SEAM Series Straight Surface PCB Header 1.27 mm Pitch Shrouded
- Samtec SEAM Series Straight Surface PCB Header 1.27 mm Pitch Shrouded
