Samtec SEAM Series Straight Surface PCB Header, 300 Contact(s), 1.27 mm Pitch, 10 Row, Shrouded
- N° de stock RS:
- 767-9022
- Référence fabricant:
- SEAM-30-02.0-S-10-2-A-K-TR
- Fabricant:
- Samtec
Offre groupée disponible
Sous-total (1 unité)*
21,97 €
(TVA exclue)
26,58 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 80,00 €
Temporairement en rupture de stock
- Expédition à partir du 27 avril 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Unité | Prix par unité |
|---|---|
| 1 - 19 | 21,97 € |
| 20 - 74 | 18,24 € |
| 75 - 299 | 16,39 € |
| 300 - 599 | 15,95 € |
| 600 + | 15,55 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 767-9022
- Référence fabricant:
- SEAM-30-02.0-S-10-2-A-K-TR
- Fabricant:
- Samtec
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Samtec | |
| Series | SEAM | |
| Product Type | PCB Header | |
| Current | 2.7A | |
| Pitch | 1.27mm | |
| Number of Contacts | 300 | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Rows | 10 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Board-to-Board | |
| Mount Type | Surface | |
| Contact Plating | Gold | |
| Contact Material | Copper Alloy | |
| Termination Type | Solder | |
| Row Pitch | 1.27mm | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 125°C | |
| Contact Gender | Male | |
| Standards/Approvals | No | |
| Sélectionner tout | ||
|---|---|---|
Marque Samtec | ||
Series SEAM | ||
Product Type PCB Header | ||
Current 2.7A | ||
Pitch 1.27mm | ||
Number of Contacts 300 | ||
Housing Material Liquid Crystal Polymer | ||
Number of Rows 10 | ||
Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Board-to-Board | ||
Mount Type Surface | ||
Contact Plating Gold | ||
Contact Material Copper Alloy | ||
Termination Type Solder | ||
Row Pitch 1.27mm | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 125°C | ||
Contact Gender Male | ||
Standards/Approvals No | ||
1.27mm SEARAY™ Series Interconnects
SEARAY™ is a 1.27mm high density, high speed board-to-board interconnect system. These SEAM / SEAF Series connectors can be mapped as a single-ended application, differential pair application, or a combination of both. When routed as a single-ended system, SEARAY™ is rated at 12.5 GHz @ -3dB. The SEAM / SEAF Series of High Speed / High Density Open Pin Field Array employs Solder Charge Technology for improved solder joint reliability. These SEAM SEAF Series SEARAY™ High Speed / High Density Open Pin Field Array use the Samtec Edge Rate contact system which gives high speed performance, zippering when mating and unmating as well as lowering insertion and extraction forces.
Various rows high density connectors suitable for board stacking applications
Stack height dependant upon SEAF/SEAM combination from 7 mm
Contact resistance: 5.5 mΩ
Contact Plating: 0.76 μm Gold on contact area with Matte Tin on tail area
Liens connexes
- Samtec SEAM Series Straight Surface PCB Header 1.27 mm Pitch Shrouded
- Samtec SEAM Series Straight Surface PCB Header 1.27 mm Pitch Shrouded
- Samtec SEAM Series Straight Surface PCB Header 1.27 mm Pitch Shrouded
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- Samtec SEAM Series Straight Surface PCB Header 1.27 mm Pitch Shrouded
- Samtec SEAM Series Horizontal Surface PCB Header 1.27 mm Pitch Shrouded
- Samtec SEAM Series Straight Surface PCB Header 1.27 mm Pitch Shrouded
- Samtec SEAM Series Horizontal Surface PCB Header 1.27 mm Pitch Shrouded